公开(公告)号：US20170304992A1

公开(公告)日：2017-10-26

申请号：US15512957

申请日：2015-09-25

Applicant: SHIN-ETSU HANDOTAI CO., LTD. ,  FUJIKOSHI MACHINERY CORP.

Inventor： Michito SATO ,  Junichi UENO ,  Kaoru ISHII ,  Hiromi KISHIDA ,  Yuya NAKANISHI ,  Ryosuke YODA ,  Yosuke KANAI

IPC: B24B37/34 ,  B24B37/04 ,  B24B53/017 ,  H01L21/304

Abstract: A polishing apparatus which is an index system polishing apparatus which includes a polishing head for holding a wafer, a plurality of turn tables to which polishing pads for polishing the wafer are attached, and a loading/unloading stage for loading the wafer to the polishing head or unloading the wafer from the polishing head, and which polishes the wafer while switching the turn tables to be used for polishing the wafer held at the polishing head by causing the polishing head to perform rotation movement, the polishing apparatus including a turn table upward and downward movement mechanism which allows the turn table to move upward and downward. With this polishing apparatus, it is possible to reduce an amount of displacement caused when moment load is applied on the polishing head during polishing.

公开(公告)号：US20170008147A1

公开(公告)日：2017-01-12

申请号：US15200156

申请日：2016-07-01

Applicant: Fujikoshi Machinery Corp.

Inventor： Mitsuhiro HARA ,  Ryosuke YODA

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: To provide a dressing apparatus capable of uniformly dressing a polishing pad. The apparatus includes first and second dressing grind stones 51 and 52 which grind polishing pads 17 and 18 by moving in a radial direction of upper and lower polishing plates 12 and 14 while abutting on corresponding polishing pads 17 and 18, in which the first and second dressing grind stones 51 and 52 are set so as to have: an inner side region portion P; an outer side region portion Q; and an intermediate region portion R, wherein the length of each of the inner side region portion P and the outer side region portion Q extending in a circumferential direction of the polishing plates 12 and 14 is longer than the length of the intermediate region portion R extending in a circumferential direction of the polishing plates.

Abstract translation: 提供能够均匀地修整抛光垫的敷料装置。 该设备包括第一和第二修整磨石51和52，其通过沿着上和下抛光板12和14的径向移动同时抵靠在相应的抛光垫17和18上来研磨抛光垫17和18，其中第一和第二 修整磨石51和52被设定为具有：内侧区域部分P; 外侧区域部分Q; 和中间区域部R，其中，沿着研磨板12和14的周向延伸的内侧区域部分P和外侧区域部分Q的长度比中间区域部分R延伸的长度长 在研磨板的圆周方向上。