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公开(公告)号:US20230150087A1
公开(公告)日:2023-05-18
申请号:US17987796
申请日:2022-11-15
发明人: ZHI-GANG ZHAO , HSING-CHIH HSU , BIN LIU , CHONG-ZHEN WANG , LANG DING , XING-LONG ZHANG , ZHAO-HENG MENG , ZHI PENG
摘要: A polishing apparatus includes a polishing device, a polishing fixing device, and a controller. The polishing fixing device includes a rotating mechanism, a sensor, a movement compensation assembly, a first moving assembly and a second moving assembly. The sensor in the polishing fixing device senses pressure applied to the workpiece during polishing, the movement compensation assembly can drive the rotating mechanism to move in compensation, so as to keep the polishing pressure within a certain range for uniformity in polishing, improving the polishing quality and production efficiency of the workpiece.