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公开(公告)号：US20240286244A1
公开(公告)日：2024-08-29
申请号：US18538398
申请日：2023-12-13
发明人： YAO-SUNG WEI
摘要： The invention relates to an electrostatic suction cup device for wafer chemical mechanical polishing, which mainly includes a wafer carrier having a suction surface from an upper end thereof; an electrostatic suction cup arranged at the corresponding suction surface in the wafer carrier; and a control module connected to the electrostatic suction cup so that the electrostatic suction cup can be controlled by the control module to generate static electricity to adsorb the wafer to the suction surface for chemical-mechanical polishing operations. Hence, wafers can be steadily absorbed without being affected by wafer thickness to improve yield and process improvement, can remove the time and cost of gluing and film application process corresponding to strengthening the wafer strength before the wafer process, can avoid the procedure, cost and risk of debonding and film removal after the process, and can increase the practical efficacy characteristics in its overall implementation.
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公开(公告)号：US20230182260A1
公开(公告)日：2023-06-15
申请号：US17780745
申请日：2021-06-30
发明人： Siying LING , Ming LING , Honglin REN , Xiaoyan LI , Liding WANG
摘要： A lapping device for gear helix artifact with equal common normal by rolling method, use the rotary table to accurately control the angle between the lapping surface of whetstone and the axis of the base-circle cylinder to control the helix angle of base-circle about the involute helicoid. Use the whetstone driven component to drive the whetstone to make a high-precision linear motion in the vertical direction to adjust the position of the lapping surface of whetstone. The distance between the two lapping surface of whetstone is precisely adjusted by the gauge block to control the processing length of the three tooth common normal of the gear helix artifact. The invention provides a lapping device for gear helix artifact with equal common normal by rolling method, it conforms to the generation principle of the involute helicoid, and there is no machining principle error.
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公开(公告)号：US20230150087A1
公开(公告)日：2023-05-18
申请号：US17987796
申请日：2022-11-15
发明人： ZHI-GANG ZHAO , HSING-CHIH HSU , BIN LIU , CHONG-ZHEN WANG , LANG DING , XING-LONG ZHANG , ZHAO-HENG MENG , ZHI PENG
摘要： A polishing apparatus includes a polishing device, a polishing fixing device, and a controller. The polishing fixing device includes a rotating mechanism, a sensor, a movement compensation assembly, a first moving assembly and a second moving assembly. The sensor in the polishing fixing device senses pressure applied to the workpiece during polishing, the movement compensation assembly can drive the rotating mechanism to move in compensation, so as to keep the polishing pressure within a certain range for uniformity in polishing, improving the polishing quality and production efficiency of the workpiece.
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公开(公告)号：US20230122191A1
公开(公告)日：2023-04-20
申请号：US17578464
申请日：2022-01-19
发明人： Yaomin Deng , Yuansi YANG
IPC分类号： B24B37/34 , B24B37/005 , B24B37/27 , H01L21/304
摘要： The present invention discloses a wafer polishing device, which comprises a second pressure medium cavity for detecting pressure changes; a porous disc with a plurality of through holes, and its lower surface is covered with a flexible single cavity film; a conduction valve unit for conduction or isolation between the second pressure medium cavity and the third pressure medium cavity, which at least includes a conduction valve seat, a conduction valve and an elastic part. The lower end of the conduction valve seat extends into the through hole, and protrudes from the lower end face of the conduction valve seat; The conduction valve seat, the porous disc and the covered flexible single cavity membrane combined to form the third pressure medium cavity; a first pressure medium cavity.
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公开(公告)号：US10562148B2
公开(公告)日：2020-02-18
申请号：US15727288
申请日：2017-10-06
发明人： Shih-Haur Shen , Kun Xu , Tzu-Yu Liu
摘要： A method of controlling processing of a substrate includes generating, based on a signal from an in-situ monitoring system, first and second sequences of characterizing values indicative of a physical property of a reference zone and a control zone, respectively, on a substrate. A reference zone rate and a control zone rate are determined from the first and sequence of characterizing values, respectively. An error value is determined by comparing characterizing values for the reference zone and control zone. An output parameter value for the control zone is generated based on at least the error value and a dynamic nominal control zone value using a proportional-integral-derivative control algorithm, and the dynamic nominal control zone value is generated in a second control loop based on at least the reference zone rate and the control zone rate. The control zone of the substrate is processed according to the output parameter value.
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公开(公告)号：US10279452B2
公开(公告)日：2019-05-07
申请号：US15720758
申请日：2017-09-29
申请人： DISCO CORPORATION
发明人： Satoshi Yamanaka
摘要： Disclosed herein is a carrying mechanism that carries a plate-shaped workpiece in which a substrate larger than a wafer in area is stacked on a lower surface of the wafer. The carrying mechanism includes a carrying pad for covering an upper surface of the wafer, holding sections for holding the substrate on outside of the outer periphery of the wafer, and a water supply source for supplying water to the wafer. The carrying mechanism forms a predetermined gap between the lower surface of the carrying pad and the upper surface of the wafer, and carries the plate-shaped workpiece in a condition where the gap is supplied with a predetermined amount of water.
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7.发明申请SYSTEMS AND METHODS FOR CORRECTING READ/WRITE OVERLAY ERRORS IN THE MANUFACTURE OF MAGNETIC TRANSDUCERS FOR STORAGE DRIVES 审中-公开用于存储驱动的磁性传感器制造中校正读/写叠加错误的系统和方法公开(公告)号：US20160346898A1
公开(公告)日：2016-12-01
申请号：US15234989
申请日：2016-08-11
IPC分类号： B24B49/10 , B24B37/04 , B24B37/005 , G11B5/31 , B24B37/27
CPC分类号： B24B49/10 , B24B37/005 , B24B37/048 , B24B37/27 , G11B5/3163 , G11B5/3166 , G11B5/3169 , G11B5/3173
摘要： Systems and methods for correcting read/write overlay errors in the manufacture of magnetic transducers for storage drives are provided. One such system includes a twisting tool configured to receive and secure a row bar having an elongated rectangular block shape and including a plurality of magnetic transducers spaced apart along a length of the row bar, and where the twisting tool is configured to twist the row bar at a plurality of areas along the length of the row bar.
摘要翻译： 提供了用于在存储驱动器的磁换能器的制造中校正读/写叠加误差的系统和方法。 一种这样的系统包括扭转工具，其被配置为接收并固定具有细长矩形块形状的行杆，并且包括沿着行杆的长度间隔开的多个磁换能器，并且其中扭转工具构造成扭转行杆 在沿着行条的长度的多个区域。
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8.发明授权Systems and methods for correcting read/write overlay errors in the manufacture of magnetic transducers for storage drives 有权用于在存储驱动器的磁换能器的制造中校正读/写叠加错误的系统和方法公开(公告)号：US09427842B1
公开(公告)日：2016-08-30
申请号：US13537018
申请日：2012-06-28
IPC分类号： B24B37/11 , B24B37/27 , B24B37/005 , G11B5/31
CPC分类号： B24B49/10 , B24B37/005 , B24B37/048 , B24B37/27 , G11B5/3163 , G11B5/3166 , G11B5/3169 , G11B5/3173
摘要： Systems and methods for correcting read/write overlay errors in the manufacture of magnetic transducers for storage drives are provided. One such system includes a twisting tool configured to receive and secure a row bar having an elongated rectangular block shape and including a plurality of magnetic transducers spaced apart along a length of the row bar, and where the twisting tool is configured to twist the row bar at a plurality of areas along the length of the row bar.
摘要翻译： 提供了用于在存储驱动器的磁换能器的制造中校正读/写叠加误差的系统和方法。 一种这样的系统包括扭转工具，其被配置为接收并固定具有细长矩形块形状的行杆，并且包括沿着行杆的长度间隔开的多个磁换能器，并且其中扭转工具构造成扭转行杆 在沿着行条的长度的多个区域。
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9.发明申请METHODS AND SYSTEMS FOR CHEMICAL MECHANICAL PLANARIZATION ENDPOINT DETECTION USING AN ALTERNATING CURRENT REFERENCE SIGNAL 审中-公开使用替代电流参考信号进行化学机械平面端点检测的方法和系统公开(公告)号：US20150371912A1
公开(公告)日：2015-12-24
申请号：US14311761
申请日：2014-06-23
发明人： Abner Bello , Michael Wedlake
IPC分类号： H01L21/66 , H01L21/67 , B24B37/04 , H01L21/306 , B24B37/005 , B24B37/27
CPC分类号： B24B37/04 , B24B37/005 , B24B37/27
摘要： Methods, non-transitory computer readable media, and systems are provided for detecting an endpoint of a chemical mechanical planarization (CMP) process on a semiconductor substrate. The method comprises generating a reference signal, generating a first signal with which to control a CMP system, generating a second signal using a combination of the first signal and the reference signal, commanding the CMP system with the second signal, generating a response signal that indicates an operational characteristic of the CMP system that is responsive to the second signal and a friction property of the semiconductor substrate, and filtering the response signal using the reference signal to determine the endpoint of the CMP process.
摘要翻译： 提供了用于检测半导体衬底上的化学机械平面化（CMP）工艺的端点的方法，非暂时计算机可读介质和系统。 该方法包括生成参考信号，产生用于控制CMP系统的第一信号，使用第一信号和参考信号的组合产生第二信号，向CMP系统指示第二信号，产生响应信号，该响应信号 表示响应于第二信号和半导体衬底的摩擦特性的CMP系统的操作特性，并且使用参考信号对响应信号进行滤波以确定CMP过程的终点。
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10.发明申请公开(公告)号：US20120309276A1
公开(公告)日：2012-12-06
申请号：US13478353
申请日：2012-05-23
申请人： Choon-Goang KIM
发明人： Choon-Goang KIM
CPC分类号： B24B37/32 , Y10T29/49 , Y10T29/49995 , Y10T83/0524
摘要： A retainer ring of a chemical mechanical polishing apparatus includes a base portion having a ring shape, the base portion including a pressurizing surface and a combining surface opposite the pressurizing surface, slurry inflowing portions on the pressurizing surface of the base portion, the slurry inflowing portions having groove shapes, and minute grooves at least on a surface portion of the slurry inflowing portions.
摘要翻译： 化学机械抛光装置的保持环包括具有环形的基部，基部包括加压表面和与加压表面相对的合并表面，基部的加压表面上的浆料流入部分，浆料流入部分 具有凹槽形状，以及至少在浆料流入部分的表面部分上的微小凹槽。
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