公开(公告)号：US07407608B2

公开(公告)日：2008-08-05

申请号：US11262851

申请日：2005-11-01

申请人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuhiko Kobayashi ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

发明人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuhiko Kobayashi ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

IPC分类号： B29C45/14 ,  H01L21/56

CPC分类号： B29C33/58 ,  B29C33/10 ,  B29C33/68 ,  B29C43/18 ,  B29C43/58 ,  B29C2043/561 ,  B29C2043/5825 ,  B29C2043/5883 ,  B29C2043/5891 ,  H01L21/565 ,  H01L21/67207 ,  H01L21/67236 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

摘要： The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

摘要翻译： 树脂成形设备包括：工件供给部; 测量安装在工件上的半导体芯片的厚度的工件测量部分; 向工件供给液体树脂的树脂供给部; 树脂模制部分，具有用于使液体树脂模制工件的模制模具; 测量模制产品的树脂模制部件的厚度的产品测量部分; 产品容纳部; 以及用于控制这些部分的控制部分。 控制部分包括根据由工件测量部测量的厚度来调节由树脂供给部分供给到工件的液体树脂的量的装置。

公开(公告)号：US20060093692A1

公开(公告)日：2006-05-04

申请号：US11262851

申请日：2005-11-01

申请人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

发明人： Fumio Miyajima ,  Kazuhiko Kobayashi ,  Kenji Nakajima ,  Naoya Gotoh ,  Kazuro Wada ,  Haruhisa Makino ,  Haruhisa Takahashi

IPC分类号： B29C47/92

CPC分类号： B29C33/58 ,  B29C33/10 ,  B29C33/68 ,  B29C43/18 ,  B29C43/58 ,  B29C2043/561 ,  B29C2043/5825 ,  B29C2043/5883 ,  B29C2043/5891 ,  H01L21/565 ,  H01L21/67207 ,  H01L21/67236 ,  H01L2224/48091 ,  H01L2924/15311 ,  H01L2924/00014

摘要： The resin molding equipment comprises: a work piece feeding section; a work piece measuring section measuring thickness of a semiconductor chip mounted on a work piece; a resin supplying section supplying liquid resin to the work piece; a resin molding section having a molding die for molding the work piece with the liquid resin; a product measuring section measuring thickness of a resin molded part of the molded product; a product accommodating section; and a control section for controlling the sections. The control section includes means for adjusting an amount of the liquid resin, which is supplied to the work piece by the resin supplying section, on the basis of the thickness measured by the work piece measuring section.

摘要翻译： 树脂成形设备包括：工件供给部; 测量安装在工件上的半导体芯片的厚度的工件测量部分; 向工件供给液体树脂的树脂供给部; 树脂模制部分，具有用于使液体树脂模制工件的模制模具; 测量模制产品的树脂模制部件的厚度的产品测量部分; 产品容纳部; 以及用于控制这些部分的控制部分。 控制部分包括根据由工件测量部测量的厚度来调节由树脂供给部分供给到工件的液体树脂的量的装置。