Miniature High Density Opto-Electronic Package
    2.
    发明申请
    Miniature High Density Opto-Electronic Package 有权
    微型高密度光电子封装

    公开(公告)号:US20140185253A1

    公开(公告)日:2014-07-03

    申请号:US13729518

    申请日:2012-12-28

    Abstract: A method comprising coupling a circuit to an opto-electronic package via an anisotropic conductive film (ACF), wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 gigahertz (GHz) to about 40 GHz. An apparatus comprising, an opto-electronic package comprising a plurality of first electrodes, and a circuit comprising a plurality of second electrodes, wherein at least one of the first electrodes is coupled to at least one of the second electrodes via an ACF, and wherein the opto-electronic package is configured to communicate electrical signals via the coupling at a maximum frequency of about 10 GHz to about 40 GHz.

    Abstract translation: 一种包括通过各向异性导电膜(ACF)将电路耦合到光电封装的方法,其中所述光电子封装被配置为经由所述耦合以大约10吉赫兹(GHz)至大约40的最大频率传送电信号 GHz。 一种装置,包括:包括多个第一电极的光电封装和包括多个第二电极的电路,其中所述第一电极中的至少一个经由ACF耦合到所述第二电极中的至少一个,并且其中 光电子封装被配置为经由耦合以大约10GHz至大约40GHz的最大频率传送电信号。

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