METHOD FOR CLEAVING AMIDE BONDS
    1.
    发明申请

    公开(公告)号:US20200002440A1

    公开(公告)日:2020-01-02

    申请号:US16305236

    申请日:2017-05-30

    申请人: GALDERMA S.A.

    IPC分类号: C08B37/00 C08B37/08

    摘要: A method for cleaving amide bonds, including: a) providing a molecule including an amide group; b) reacting the molecule including the amide group with a hydroxylamine salt to cleave the amide bond of the amide group. The method may further include c) recovering a product formed by the reaction of step b).