公开(公告)号：US20180112723A1

公开(公告)日：2018-04-26

申请号：US15334071

申请日：2016-10-25

申请人： GE AVIATION SYSTEMS, LLC

发明人： Luis Javier Pando Rodriguez ,  Armando Herrera Velázquez ,  José Israel Zaragoza Hernández ,  Jorge Alberto Martínez Vargas ,  Edgar Moises Romero Ramos ,  Luis Antonio Mendoza Gomez ,  Pablo David Del Castillo Marcial ,  Aquiles Tiscareño Macias

IPC分类号： F16D27/102 ,  F02C7/275 ,  F16D15/00 ,  H02K7/00

摘要： A decoupler assembly for disengaging a shaft transmitting torque between a rotatory engine and an electric generator. The decoupler assembly includes an output shaft, input shaft wherein the output shaft is selectively coupled to the input shaft. Retractable balls are incorporated into the assembly in order to couple and decouple the input shaft from the output shaft.

公开(公告)号：US10690196B2

公开(公告)日：2020-06-23

申请号：US15334071

申请日：2016-10-25

申请人： GE AVIATION SYSTEMS LLC

发明人： Luis Javier Pando Rodriguez ,  Armando Herrera Velázquez ,  José Israel Zaragoza Hernández ,  Jorge Alberto Martínez Vargas ,  Edgar Moises Romero Ramos ,  Luis Antonio Mendoza Gomez ,  Pablo David Del Castillo Marcial ,  Aquiles Tiscareño Macias

IPC分类号： H02K7/00 ,  F16D27/102 ,  F16D15/00 ,  H02K7/18 ,  F02C7/32 ,  H02K7/10

摘要： A decoupler assembly for disengaging a shaft transmitting torque between a rotatory engine and an electric generator. The decoupler assembly includes an output shaft, input shaft wherein the output shaft is selectively coupled to the input shaft. Retractable balls are incorporated into the assembly in order to couple and decouple the input shaft from the output shaft.

公开(公告)号：US20180177072A1

公开(公告)日：2018-06-21

申请号：US15383607

申请日：2016-12-19

申请人： GE AVIATION SYSTEMS, LLC

发明人： Luis Javier Pando Rodriguez ,  Armando Herrera Velázquez ,  Luis Antonio Mendoza Gómez ,  Jorge Alberto Martínez Vargas ,  Federico Taboada Reyes ,  Diego Hernandez Guerra ,  Ramon Morales Rueda ,  Aquiles Tiscareño Macias

IPC分类号： H05K7/20 ,  H05K9/00 ,  F28F21/02 ,  F28F21/08

CPC分类号： H05K7/20409 ,  H01L23/373 ,  H01L23/467 ,  H05K7/20163

摘要： A method and apparatus for heat-dissipation in an electronics chassis can include a housing having an interior and exterior, at least two walls, at least one of which is a thermally conductive wall, a heat spreader operably coupled to at least a portion of the housing to dissipate or spread heat from a heat producing component.