公开(公告)号：US20170178991A1

公开(公告)日：2017-06-22

申请号：US15036641

申请日：2014-11-13

Applicant: GEMALTO SA

Inventor： Stéphane OTTOBON ,  Lucile DOSSETTO ,  Lauren AUDOUARD ,  Sébastien GUIJARRO

IPC: H01L23/31 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/568 ,  H01L23/562 ,  H01L24/48 ,  H01L24/49 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099

Abstract: The invention relates to a method for producing an electronic device including at least one electronic component in a substrate body, said method including at least one step of transferring said electronic component to a surface of a removable dielectric substrate, of delivering a protective resin on said electronic component, and of transferring, onto the protective resin, a reinforcement disc having a main front surface with a peripheral contour, wherein the protective resin extends up to the peripheral contour of the disc in order to form, together with the disc, the peripheral side contours and the final layer of the substrate body of the device.