公开(公告)号：US10013651B2

公开(公告)日：2018-07-03

申请号：US14441088

申请日：2013-11-25

Applicant: GEMALTO SA

Inventor： Stephane Ottobon ,  Jean-Christophe Fidalgo ,  Laurent Audouard ,  Frederick Seban

IPC: G06K19/077 ,  H01L31/18

CPC classification number: G06K19/07754 ,  G06K19/07728 ,  G06K19/07775 ,  H01L31/18

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

公开(公告)号：US20150228505A1

公开(公告)日：2015-08-13

申请号：US14424124

申请日：2013-09-17

Applicant: GEMALTO SA

Inventor： Stéphane Ottobon ,  Lucile Dossetto ,  Laurent Audouard ,  Sébastien Guijarro

IPC: H01L21/48

CPC classification number: H01L21/4803 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3107 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The invention concerns a method for producing a smart card or telecommunication module electronic housing, comprising an electronic chip in the housing, a face comprising at least one set of conductive metal platings, said method comprising the following steps: providing or producing at least one set of metal platings comprising conductive circuit pads or tracks, on one side of a substrate, transferring and connecting a chip to each set of platings, overmoulding each chip with the set of metal platings of same on the substrate with a moulding material in order to produce at least one housing, separating the housing from the substrate thereof, wherein the side of the substrate in contact with the metal platings comprises an adhesive or has low adhesiveness and in that the overmoulding is carried out at the final dimensions of the housing. The invention also concerns a moulding apparatus and the housing obtained.

Abstract translation: 本发明涉及一种用于生产智能卡或电信模块电子外壳的方法，包括壳体中的电子芯片，包括至少一组导电金属电镀的面，所述方法包括以下步骤：提供或产生至少一组 的金属电镀包括导电电路板或轨道，在基板的一侧上，将芯片转移并连接到每组电镀板，用模制材料在基板上用其一组金属镀覆盖每个芯片，以便产生 至少一个壳体，其将所述壳体与其基底分离，其中与所述金属镀层接触的所述基底的侧面包括粘合剂或具有低粘合性，并且所述包覆成型在所述壳体的最终尺寸下进行。 本发明还涉及一种成型设备和获得的壳体。

公开(公告)号：US20150269473A1

公开(公告)日：2015-09-24

申请号：US14441088

申请日：2013-11-25

Applicant: GEMALTO SA

Inventor： Stephane Ottobon ,  Jean-Christophe Fidalgo ,  Laurent Audouard ,  Frederick Seban

IPC: G06K19/077 ,  H01L31/18

CPC classification number: G06K19/07754 ,  G06K19/07728 ,  G06K19/07775 ,  H01L31/18

Abstract: The invention relates to a method for making an electronic module having an integrated circuit chip connected to an antenna. The method includes the steps of producing a module having electrical interconnection areas, a chip connected to the interconnection areas and a protection element covering at least the chip and part of the interconnection areas, and a radio antenna connected to the chip and arranged above the chip. The method includes a step of producing the entirety or part of the antenna, or the tracks thereof for coupling same with the interconnection areas, in three dimensions directly on the protection element.

Abstract translation: 本发明涉及一种制造具有连接到天线的集成电路芯片的电子模块的方法。 该方法包括以下步骤：制造具有电互连区域的模块，连接到互连区域的芯片和至少覆盖芯片和互连区域的一部分的保护元件，以及连接到芯片并布置在芯片上方的无线电天线 。 该方法包括以三维直接在保护元件上产生天线整体或部分的一部分或其轨道，用于将其连接到互连区域。