公开(公告)号：US20180323139A1

公开(公告)日：2018-11-08

申请号：US15773673

申请日：2016-10-28

Applicant: GEMALTO SA

Inventor： Line Degeilh ,  Remy Janvrin ,  Lucile Dossetto ,  Alain Le Loc'h ,  Jean-Christophe Fidalgo

IPC: H01L23/498 ,  H01L21/48 ,  G06K19/07

CPC classification number: H01L23/49855 ,  G06K19/00 ,  G06K19/0723 ,  H01L21/4867 ,  H01L2224/49171

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.

公开(公告)号：US20180351233A1

公开(公告)日：2018-12-06

申请号：US15780465

申请日：2016-12-13

Applicant: GEMALTO SA

Inventor： Remy Janvrin ,  Line Degeilh ,  Lucile Dossetto ,  Stéphane Ottobon

IPC: H01Q1/22

Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

公开(公告)号：US10804594B2

公开(公告)日：2020-10-13

申请号：US15780465

申请日：2016-12-13

Applicant: GEMALTO SA

Inventor： Remy Janvrin ,  Line Degeilh ,  Lucile Dossetto ,  Stéphane Ottobon

IPC: H01Q1/22 ,  H01Q7/00

Abstract: The invention relates to a module with integrated circuit chip, comprising an insulating substrate, metallisations comprising conductive tracks produced on one side of the substrate, forming an antenna and comprising two connection ends, and a coating area or location of the radiofrequency integrated circuit chip and of a device in the form of a surface-mounted device, the radiofrequency integrated circuit chip and the device being disposed on the same face of the substrate and connected to the antenna. The metallisations are on a single same side of the insulating substrate, the connection being made by means of perforations through the insulating film or directly on the surface metallisations.

公开(公告)号：US10658283B2

公开(公告)日：2020-05-19

申请号：US15773673

申请日：2016-10-28

Applicant: GEMALTO SA

Inventor： Line Degeilh ,  Remy Janvrin ,  Lucile Dossetto ,  Alain Le Loc'h ,  Jean-Christophe Fidalgo

IPC: H01L21/00 ,  H01L23/498 ,  H01L21/48 ,  G06K19/07 ,  G06K19/00

Abstract: The invention relates to a method for manufacturing a device with a secure integrated-circuit chip, said device having an insulating substrate, electrically conductive surfaces on the substrate, which surfaces are connected or coupled to said electronic chip, said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.