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公开(公告)号：USD843996S1
公开(公告)日：2019-03-26
申请号：US29614800
申请日：2017-08-23
Applicant: GENERAL ELECTRIC COMPANY
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公开(公告)号：USD747683S1
公开(公告)日：2016-01-19
申请号：US29486610
申请日：2014-04-01
Applicant: General Electric Company
Designer： Andrew Louis Krivonak , Mark Allen Murphy , Theodore Clark Brown , Frank Dolski , Michael Grutkowski
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公开(公告)号：US10032693B2
公开(公告)日：2018-07-24
申请号：US14918082
申请日：2015-10-20
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Shreenath Shekar Perlaguri , Rajendra Yammanuru , Arunpandi Radhakrishnan , Theodore Clark Brown
IPC: H01L23/40 , H01L23/467 , H01L23/473 , B23K1/00 , H05K7/20
Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.
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公开(公告)号：USD802582S1
公开(公告)日：2017-11-14
申请号：US29573548
申请日：2016-08-08
Applicant: GENERAL ELECTRIC COMPANY
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公开(公告)号：US09648789B2
公开(公告)日：2017-05-09
申请号：US14511441
申请日：2014-10-10
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Mark Allen Murphy
IPC: H05K7/20
CPC classification number: H05K7/209
Abstract: An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment.
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Patent Agency Ranking
公开(公告)号：USD742340S1
公开(公告)日：2015-11-03
申请号：US29495308
申请日：2014-06-30
Applicant: General Electric Company
Designer： Andrew Louis Krivonak , Joseph Lauth
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公开(公告)号：USD798813S1
公开(公告)日：2017-10-03
申请号：US29582988
申请日：2016-11-01
Applicant: General Electric Company
Designer： Matt Anthony Marinelli , Andrew Louis Krivonak , Mark Allen Murphy
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公开(公告)号：USD760665S1
公开(公告)日：2016-07-05
申请号：US29542627
申请日：2015-10-15
Applicant: General Electric Company
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公开(公告)号：USD760663S1
公开(公告)日：2016-07-05
申请号：US29542285
申请日：2015-10-13
Applicant: General Electric Company
Designer： Andrew Louis Krivonak , Mark Allen Murphy , Frank Dolski
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公开(公告)号：US20160105992A1
公开(公告)日：2016-04-14
申请号：US14511441
申请日：2014-10-10
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Mark Allen Murphy
IPC: H05K7/20
CPC classification number: H05K7/209
Abstract: An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment.
Abstract translation: 提供一种包括用于电子设备的外壳的设备。 壳体包括多个侧壁和可移除的外部外壳面板。 当面板被固定到多个侧壁时，电路板机械地附接到面板的第一侧，面向壳体的内部。 面板由导热材料制成，以将热量从电路板传导到面板和外部环境。
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