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公开(公告)号：USD843996S1
公开(公告)日：2019-03-26
申请号：US29614800
申请日：2017-08-23
Applicant: GENERAL ELECTRIC COMPANY
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公开(公告)号：USD834530S1
公开(公告)日：2018-11-27
申请号：US29625991
申请日：2017-11-14
Applicant: GENERAL ELECTRIC COMPANY
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公开(公告)号：US10032693B2
公开(公告)日：2018-07-24
申请号：US14918082
申请日：2015-10-20
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Shreenath Shekar Perlaguri , Rajendra Yammanuru , Arunpandi Radhakrishnan , Theodore Clark Brown
IPC: H01L23/40 , H01L23/467 , H01L23/473 , B23K1/00 , H05K7/20
Abstract: A system includes a front plate, a manifold cover, and bridge heat sinks. The manifold cover is secured to the front plate to define a fluid distribution chamber along a front side of the front plate. The manifold cover defines a port opening through which a cooling fluid is received from outside of the manifold cover. The bridge heat sinks extend rearward from a back side of the front plate. The bridge heat sinks define fluid channels that are fluidly connected with the fluid distribution chamber through corresponding slots in the front plate. The fluid distribution chamber is configured to distribute the cooling fluid received from outside of the manifold cover through the fluid channels of the bridge heat sinks in order to cool one or more electronics packages disposed along the bridge heat sinks without the cooling fluid engaging the one or more electronics packages.
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公开(公告)号：USD802582S1
公开(公告)日：2017-11-14
申请号：US29573548
申请日：2016-08-08
Applicant: GENERAL ELECTRIC COMPANY
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公开(公告)号：USD800670S1
公开(公告)日：2017-10-24
申请号：US29501019
申请日：2014-08-29
Applicant: General Electric Company
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Patent Agency Ranking
公开(公告)号：US10454349B2
公开(公告)日：2019-10-22
申请号：US14686939
申请日：2015-04-15
Applicant: General Electric Company
Inventor： Sarit Ratadiya , Jacob Alan Hubbell , Ajith Kuttannair Kumar , Mark Murphy , Shreenath Shekar Perlaguri
Abstract: An inverter drive assembly includes a first array of inverters, a second array of inverters spaced from the first array of inverters and defining a plenum therebetween, and a crossover bus bar spanning the plenum and electrically connecting the first array of inverters to the second array of inverters. The crossover bus bar includes a first laminated bus section electrically connected to the first array of inverters, a second laminated bus section electrically connected to the second array of inverters, and a solid bus connection interconnecting the first laminated bus section with the second laminated bus section.
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公开(公告)号：USD848955S1
公开(公告)日：2019-05-21
申请号：US29668068
申请日：2018-10-26
Applicant: General Electric Company
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公开(公告)号：USD784265S1
公开(公告)日：2017-04-18
申请号：US29565997
申请日：2016-05-26
Applicant: GENERAL ELECTRIC COMPANY
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公开(公告)号：US10383261B2
公开(公告)日：2019-08-13
申请号：US15222478
申请日：2016-07-28
Applicant: General Electric Company
Inventor： Andrew Louis Krivonak , Theodore Clark Brown , Shreenath Shekar Perlaguri , Brian Magann Rush , Rajendra Yammanuru , Naveenan Thiagarajan , Arunpandi Radhakrishnan
IPC: H05K7/20 , H01L23/467 , H01L23/473
Abstract: A system includes a front plate, first and second side plates extending from the front plate, a bridge heat sink coupled to and extending from the front plate between the side plates, and a heat pipe coupled to the front plate. The front plate defines a slot therethrough between the front and back sides. The first side plate includes a fin bank mounted on an outer side thereof. The bridge heat sink defines a fluid channel that is fluidly connected to the slot of the front plate. The fluid channel is configured to receive a first cooling fluid therein to dissipate heat from electronics packages that engage the bridge heat sink. The heat pipe extends to and at least partially through the fin bank. The heat pipe contains a second cooling fluid therein that transfers heat absorbed from the front plate to the fin bank for dissipating heat.
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公开(公告)号：USD825463S1
公开(公告)日：2018-08-14
申请号：US29628414
申请日：2017-12-05
Applicant: GENERAL ELECTRIC COMPANY
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