公开(公告)号：US10356945B2

公开(公告)日：2019-07-16

申请号：US15228336

申请日：2016-08-04

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Brian Rush ,  James William Sears

IPC: H05K7/20 ,  B22F3/11 ,  B22F3/105 ,  B33Y80/00 ,  F28D15/04 ,  F28D15/02 ,  G06F1/20

Abstract: In accordance with one aspect of the invention, a thermal management system for electronics includes a vapor chamber that at least partially envelops the electronics, a working fluid contained within the vapor chamber and used to dissipate heat from a part of a heated portion of the electronics and a precision sintered 3D wick structure independently created on some of the interior of the vapor chamber. The precision sintered 3D wick structure transports the working fluid by capillary action from at least one working fluid receptacle to a part of the heated portion of the electronics. In one embodiment of the invention, the 3D vapor chamber may be formed by the additive manufacturing processes. A further example includes precision sintered 3D support structures integrated into the closed 3D vapor chamber. The support structures mainly facilitate to support the 3D closed vapor chamber envelope from collapsing during operation, and add overall structural strength and additionally facilitate transfer of liquids and gas through their internal 3D porous zones.

公开(公告)号：US20170064868A1

公开(公告)日：2017-03-02

申请号：US15228336

申请日：2016-08-04

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Brian Rush ,  James William Sears

IPC: H05K7/20 ,  F28F13/00

CPC classification number: H05K7/20336 ,  B22F3/1055 ,  B22F3/1103 ,  B22F2003/1058 ,  B22F2999/00 ,  B33Y80/00 ,  F28D15/0233 ,  F28D15/046 ,  F28F2255/18 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20672 ,  Y02P10/295 ,  B22F7/004

Abstract: In accordance with one aspect of the invention, a thermal management system for electronics includes a vapor chamber that at least partially envelops the electronics, a working fluid contained within the vapor chamber and used to dissipate heat from a part of a heated portion of the electronics and a precision sintered 3D wick structure independently created on some of the interior of the vapor chamber. The precision sintered 3D wick structure transports the working fluid by capillary action from at least one working fluid receptacle to a part of the heated portion of the electronics. In one embodiment of the invention, the 3D vapor chamber may be formed by the additive manufacturing processes. A further example includes precision sintered 3D support structures integrated into the closed 3D vapor chamber. The support structures mainly facilitate to support the 3D closed vapor chamber envelope from collapsing during operation, and add overall structural strength and additionally facilitate transfer of liquids and gas through their internal 3D porous zones.

Abstract translation: 根据本发明的一个方面，用于电子器件的热管理系统包括至少部分地包围电子器件的蒸气室，包含在蒸气室内的工作流体，用于从电子部件的一部分散热 以及独立地在蒸气室的一些内部上产生的精密烧结3D芯体结构。 精密烧结3D芯结构通过毛细管作用将工作流体从至少一个工作流体容器输送到电子器件的加热部分的一部分。 在本发明的一个实施例中，3D蒸汽室可以通过添加剂制造工艺形成。 另外的例子包括集成到封闭3D蒸气室中的精密烧结3D支撑结构。 支撑结构主要有助于在操作期间支撑3D闭合蒸气室封套塌陷，并增加总体结构强度，并且另外促进液体和气体通过其内部3D多孔区域传递。