公开(公告)号：US20140190834A1

公开(公告)日：2014-07-10

申请号：US13735293

申请日：2013-01-07

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Eklavya CALLA ,  Krishnamurthy ANAND ,  Chakrakody SHASTRY

IPC: B05D7/24 ,  C25D3/02

CPC classification number: C25D3/02 ,  C23C4/02 ,  C23C4/11 ,  C23C18/1605 ,  C23C18/1667 ,  C23C18/1692 ,  C23C24/04 ,  C23C28/321 ,  C23C28/3215 ,  C23C28/325 ,  C23C28/345 ,  C23C28/3455 ,  C25D5/022 ,  C25D5/06 ,  C25D5/50 ,  C25D7/00 ,  C30B29/52 ,  C30B33/00 ,  F01D5/288 ,  F05D2230/90 ,  F05D2300/606 ,  F05D2300/607

Abstract: A plated component and a plating process are disclosed. The plating process includes applying a material to a region of a component, the material being selected from the group consisting of nickel, cobalt, chromium, iron, aluminum, or a combination thereof. The region includes a single crystal microstructure, includes a directionally solidified microstructure, is substantially devoid of equiaxed microstructure, or a combination thereof. The applying includes electroplating, electroless plating, or the electroplating and the electroless plating. The plated component includes an electroplated region, an intermediate layer on the electroplated region, and an overlay coating on the intermediate layer.

Abstract translation: 公开了电镀部件和电镀工艺。 电镀工艺包括将材料施加到部件的区域，该材料选自镍，钴，铬，铁，铝或其组合。 该区域包括单晶微结构，包括定向凝固的微结构，基本上不具有等轴显微组织，或其组合。 该应用包括电镀，无电镀，或电镀和化学镀。 电镀部件包括电镀区域，电镀区域上的中间层以及中间层上的覆盖层。