公开(公告)号：US20240166829A1

公开(公告)日：2024-05-23

申请号：US18493335

申请日：2023-10-24

Applicant: AC Products Inc.

Inventor： Thomas P. Farrell ,  Bryan Vu ,  David Tomlinson ,  Peter Weissman

IPC: C08J5/18 ,  B32B15/082 ,  B32B15/20 ,  B32B27/18 ,  B32B27/30 ,  C23C14/04 ,  C23C14/24 ,  C23C16/04 ,  C23C18/16

CPC classification number: C08J5/18 ,  B32B15/082 ,  B32B15/20 ,  B32B27/18 ,  B32B27/302 ,  C23C14/042 ,  C23C14/24 ,  C23C16/042 ,  C23C18/1605 ,  B29C48/154 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/54 ,  C08J2347/00 ,  C08J2423/22

Abstract: In one aspect, the present disclosure provides a polymer film with a low glass transition temperature. In one embodiment, when in contact with a metal substrate, the polymer film adheres to the metal substrate under heating and/or mechanical pressure. In one embodiment, the polymer film comprises a butadiene copolymer and a butylene polymer. In another aspect, the present disclosure further provides a method of masking a metal substrate using the polymer film. In yet another aspect, the present disclosure provides a method of chemically or electrochemically processing a metal substrate that is masked with the polymer film.

公开(公告)号：US20230182434A1

公开(公告)日：2023-06-15

申请号：US18079808

申请日：2022-12-12

Applicant: Metamaterial Technologies USA, Inc.

Inventor： Boris Kobrin

IPC: B32B3/30 ,  C23C18/16 ,  C23C18/22 ,  B32B3/02 ,  B32B15/04 ,  B32B15/02 ,  B32B15/08

CPC classification number: B32B3/30 ,  C23C18/165 ,  C23C18/1605 ,  C23C18/22 ,  B32B3/02 ,  B32B15/04 ,  B32B15/02 ,  B32B15/08 ,  B05D5/083

Abstract: A self-cleaning transparent conductive surface includes a hydrophobic film and a metal nano-web coupled to the hydrophobic film. The metal nano-web imparts conductive properties to the surface of the film and texturing formed by either the hydrophobic film, substrate or metal nano-web create a super-hydrophobic surface. This super-hydrophobic and conductive surface may be created by etching and layering a metal nano-web over the surface of a hydrophobic film or a rigid substrate, the metal grid may the hydrophobic film or substrate may also be etched in a moth's eye pattern. Both the hydrophobic film or substrate and metal nano-web may be coated in a layer of hydrophobic material to further increase the hydrophobic effect.

公开(公告)号：US20180272714A1

公开(公告)日：2018-09-27

申请号：US15924725

申请日：2018-03-19

Applicant: SII Printek Inc.

Inventor： Hitoshi NAKAYAMA ,  Takeshi SUGIYAMA ,  Daichi NISHIKAWA ,  Eriko MAEDA

IPC: B41J2/16 ,  C23C18/32 ,  C23C18/42 ,  C23C18/16 ,  G03F7/16 ,  H01L41/047 ,  H01L41/09 ,  H01L41/29

CPC classification number: B41J2/1643 ,  B41J2/14209 ,  B41J2/1607 ,  B41J2/1609 ,  B41J2/1623 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1635 ,  B41J2/1642 ,  B41J2002/14491 ,  C23C18/1605 ,  C23C18/32 ,  C23C18/42 ,  G03F7/16 ,  H01L41/047 ,  H01L41/09 ,  H01L41/1876 ,  H01L41/29

Abstract: A discharge channel and a non-discharge channel are formed to have a similar shape, that is, to include extension portions and raise-and-cut portions continuing from end portions of both the extension portions, respectively. Then, imparting of a catalyst, washing of an unnecessary catalyst, plating, and the like are performed on a target surface, as a plating step. In an embodiment, an electrode clearance groove is formed after the plating step. Since channel grooves for the discharge channel and the non-discharge channel have a similar shape, it is possible to cause a water flow to uniformly flow in the channels when washing is performed, and thus to avoid an occurrence of a situation in which a lump is formed in the channel groove by plating.

公开(公告)号：US20180235115A1

公开(公告)日：2018-08-16

申请号：US15947080

申请日：2018-04-06

Applicant: Laird Technologies (SHENZHEN) Ltd.

Inventor： Richard TSAI ,  Dusan LEE ,  Larry Don CREASY, JR.

IPC: H05K9/00 ,  C23C18/16 ,  C23C18/38

CPC classification number: H05K9/0084 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1614 ,  C23C18/163 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/38 ,  C23C18/405 ,  H05K3/381 ,  Y10T428/24802 ,  Y10T428/24826 ,  Y10T428/2962 ,  Y10T428/31786

Abstract: According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.

公开(公告)号：US20180208792A1

公开(公告)日：2018-07-26

申请号：US15928527

申请日：2018-03-22

Applicant: Jun YANG

Inventor： Jun YANG ,  Mingjun HU ,  Tengyuan ZHANG ,  Qiuquan GUO

IPC: C09D139/08 ,  B05D3/06 ,  B05D3/02 ,  C23C18/42 ,  C23C18/16 ,  C09D7/20 ,  C09D7/63 ,  C08J7/04 ,  H05K3/12 ,  H05K3/18

CPC classification number: C09D139/08 ,  B05D1/18 ,  B05D3/0254 ,  B05D3/0272 ,  B05D3/067 ,  B05D7/02 ,  B05D2401/10 ,  B05D2518/00 ,  C08J7/047 ,  C08J2367/02 ,  C08J2439/08 ,  C08L39/08 ,  C09D7/20 ,  C09D7/63 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/165 ,  C23C18/2006 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/32 ,  C23C18/405 ,  C23C18/42 ,  H05K1/038 ,  H05K1/0386 ,  H05K1/0393 ,  H05K3/1208 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K2203/013 ,  H05K2203/072 ,  H05K2203/0783 ,  H05K2203/125 ,  C08L63/00

Abstract: The present disclosure provides a coating composition for use in coating polyester film, polyimide film, polyvinyl chloride film, semi-embossed film, polyvinyl chloride film and like, comprises poly(4-vinyl pyridine), SU-8, a solution such as isopropyl alcohol, 1,4-dioxane. A simple universal solution-based coating method for fast surface modification of various substances by applying an effective amount of pyridine ligands to immobilize transitional metal ions that can behave as the catalyst of electroless copper plating for surface metallization while functioning as the adhesion-promoting layer between the substrate and deposited metal.

公开(公告)号：US20180187325A1

公开(公告)日：2018-07-05

申请号：US15905939

申请日：2018-02-27

Applicant: Just Co., Ltd.

Inventor： Takashi Konno

IPC: C25D15/00 ,  C25D7/00 ,  C25D5/14 ,  A61B17/30 ,  C23C18/16 ,  C25D5/02 ,  C23C28/02 ,  C23C18/32 ,  A61B17/00 ,  A61B17/28

CPC classification number: C25D15/00 ,  A61B17/062 ,  A61B17/28 ,  A61B17/30 ,  A61B2017/00429 ,  A61B2017/00526 ,  A61B2017/00858 ,  A61B2017/305 ,  C23C18/1605 ,  C23C18/1653 ,  C23C18/1662 ,  C23C18/32 ,  C23C28/021 ,  C23C28/023 ,  C23C28/027 ,  C25D5/022 ,  C25D5/14 ,  C25D7/00

Abstract: A plating processing method of a gripping surface of a gripping tool includes: temporarily and evenly fixing a plurality of first diamond grains having a uniform first grain diameter; adhering the first diamond grains by depositing a metal containing nickel on a gripping surface in a uniform thickness after the first diamond grains have been temporarily fixed; placing a plurality of second diamond grains having a second grain diameter on a metal surface of the gripping surface on which first diamond grains are not present; and adhering the second diamond grains by further depositing a metal containing nickel within a second plating solution on the metal surface in a uniform thickness that does not exceed the first diameter grain and the second diameter grain until a position relationship between the metal surface and the second diamond grains is not displaced even when the gripping tool is moved.

公开(公告)号：US09850578B1

公开(公告)日：2017-12-26

申请号：US15263645

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/38 ,  C09K13/00 ,  C23C18/22 ,  C23C18/20

CPC classification number: C23C18/1641 ,  C09K13/00 ,  C23C18/1605 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain five-membered heterocyclic nitrogen compounds and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US20170330861A1

公开(公告)日：2017-11-16

申请号：US15536185

申请日：2015-12-22

Applicant: Atotech Deutschland GmbH

Inventor： Kenichiroh MUKAI ,  Kwonil KIM ,  Lee GAHERTY ,  Lutz BRANDT ,  Tafadzwa MAGAYA

IPC: H01L25/065 ,  H01L25/00

CPC classification number: H01L23/552 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/1698 ,  C23C18/285 ,  C23C18/30 ,  C23C18/36 ,  C23C18/405 ,  C23C18/42 ,  C23C18/50 ,  C23C18/54 ,  H01L21/02076 ,  H01L21/02211 ,  H01L21/02282 ,  H01L21/02301 ,  H01L21/4871 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3142 ,  H01L23/3735 ,  H01L23/3736 ,  H01L2924/15311

Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.

公开(公告)号：US09797043B1

公开(公告)日：2017-10-24

申请号：US15263640

申请日：2016-09-13

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hung Tat Chan ,  Ka Ming Yip ,  Chit Yiu Chan ,  Kwok Wai Yee

IPC: H01B13/00 ,  C23C18/16 ,  C23C18/38 ,  C23C18/18

CPC classification number: C23C18/38 ,  C23C18/1605 ,  C23C18/1641 ,  C23C18/2006 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/22 ,  C23C18/285 ,  C23C18/30 ,  C23C18/40

Abstract: Shielding coatings are applied to polymer substrates for selective metallization of the substrates. The shielding coatings include a primer component and a hydrophobic top coat. The primer is first applied to the polymer substrate followed by application of the top coat component. The shielding coating is then selectively etched to form an outline of a desired current pattern. A catalyst is applied to the patterned polymer substrate followed by electroless metal plating in the etched portions. The portions of the polymer substrate which contain the shielding coating inhibit electroless metal plating. The primers contain aromatic heterocyclic compounds and the top coat contains hydrophobic alky organic compounds.

公开(公告)号：US09789664B2

公开(公告)日：2017-10-17

申请号：US14903305

申请日：2014-07-09

Applicant: United Technologies Corporation

Inventor： Grant O. Cook, III ,  James T. Roach

IPC: B32B15/08 ,  C25D5/02 ,  C25D7/04 ,  C23C18/16 ,  B29B11/06 ,  B29B11/14 ,  B29C43/18 ,  B29C45/14 ,  C23C26/00 ,  E04B1/19 ,  E04B1/30 ,  B29K101/10 ,  B29K101/12 ,  B29K105/20 ,  B29K705/00 ,  B29L9/00

CPC classification number: B32B15/08 ,  B29B11/06 ,  B29B11/14 ,  B29C43/183 ,  B29C45/14 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/20 ,  B29K2705/00 ,  B29L2009/00 ,  B32B2250/02 ,  B32B2307/558 ,  B32B2605/00 ,  C23C18/1605 ,  C23C26/00 ,  C25D5/022 ,  C25D7/04 ,  E04B1/19 ,  E04B1/30 ,  E04B2001/1927

Abstract: A plated tubular lattice structure is described. The plated tubular lattice structure may comprise a backbone structure which may include a plurality of axial posts and a plurality of pyramidal structures extending laterally from the axial posts and connecting the axial posts at nodes. The plated tubular lattice structure may further comprise a metal plating layer plated on an outer surface of the backbone structure.