公开(公告)号：US20170232670A1

公开(公告)日：2017-08-17

申请号：US15041980

申请日：2016-02-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Daniel JOERGER ,  Neal DUNHAM

IPC: B29C67/00

CPC classification number: B29C64/153 ,  B22F3/1055 ,  B22F2003/1058 ,  B22F2003/1059 ,  B22F2003/247 ,  B22F2998/10 ,  B22F2999/00 ,  B29C64/40 ,  B33Y10/00 ,  Y02P10/295 ,  B22F2201/20 ,  B22F2202/01 ,  B22F2202/15

Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize powder removal ports in the process of building objects, as well as novel support structures including powder removal ports to be used within these AM processes. The objects include walls defining regions of unfused powder. The powder removal ports include at least one tube aligned with an opening in the walls to allow removal of the powder. The methods include removing unfused powder from the enclosed space via the at least one tube.

公开(公告)号：US20180079148A1

公开(公告)日：2018-03-22

申请号：US15268192

申请日：2016-09-16

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Stephen Michael DEAK ,  Daniel JOERGER ,  Travis SANDS

IPC: B29C67/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02

CPC classification number: B33Y10/00 ,  B22F3/1055 ,  B22F2003/1056 ,  B22F2003/1057 ,  B29C64/135 ,  B29C64/153 ,  B29C64/264 ,  B29K2105/0058 ,  B33Y30/00 ,  B33Y50/02 ,  Y02P10/295

Abstract: The present disclosure generally relates to methods and apparatuses for additive manufacturing (AM) that utilize a pulsed laser to solidify a liquid photopolymer. The method includes scanning a first portion of the photopolymer with the laser at a first draw speed, wherein the first portion of the photopolymer corresponds to a first portion of the part that has a width less than a threshold width. The method also includes scanning a second portion of the photopolymer with the laser at a second draw speed that is greater than the first draw speed, wherein the second portion of the photopolymer corresponds to a second portion of the part that has a width greater than the threshold width.

公开(公告)号：US20180111334A1

公开(公告)日：2018-04-26

申请号：US15335116

申请日：2016-10-26

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Scott Alan GOLD ,  Zachary David FIELDMAN ,  Daniel JOERGER

IPC: B29C67/00 ,  B33Y10/00

CPC classification number: B33Y10/00 ,  B22F3/1055 ,  B22F5/003 ,  B22F2003/1058 ,  B29C64/153 ,  B29C64/40 ,  B29L2009/00 ,  Y02P10/295

Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize thermal dissipation support structures in the process of building objects, as well as novel thermal dissipation support structures to be used within these AM processes. The thermal dissipation support structures include at least one sacrificial structure that is separated from the object by a portion of unfused powder. The sacrificial structure increases a thermal dissipation rate of at least a portion of the object such that such that thermal gradients in the object remain below a specified threshold that prevents deformation of the object.

公开(公告)号：US20170232672A1

公开(公告)日：2017-08-17

申请号：US15042010

申请日：2016-02-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Zachary David FIELDMAN ,  Daniel JOERGER ,  Neal DUNHAM

IPC: B29C67/00

CPC classification number: B33Y10/00 ,  B22F3/1055 ,  B22F2003/1058 ,  B22F2998/10 ,  B22F2999/00 ,  B29C64/153 ,  B29C64/40 ,  B33Y40/00 ,  Y02P10/295 ,  B22F2003/247

Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize support structure in the process of building objects that may be removed by rotating the support structure to a second orientation before removal, as well as novel support structures to be used within these AM processes. The support structures are fabricated in a first orientation and then rotated to the second orientation. The support structures are removed by passing through an outlet of the object.

公开(公告)号：US20170232512A1

公开(公告)日：2017-08-17

申请号：US15042019

申请日：2016-02-11

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Daniel JOERGER

IPC: B22F3/105

Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize conformal support structures in the process of building objects, as well as novel conformal support structures to be used within these AM processes. The conformal support structures include a first portion that extends from a platform to a concave upward surface of the first portion that is below a downward facing convex surface of the object. The concave upward surface corresponds to the downward facing convex surface. The downward facing convex surface of the object is separated from the concave upward surface of the first portion by at least one portion of unfused powder