-
公开(公告)号：US20180369918A1
公开(公告)日：2018-12-27
申请号：US15631920
申请日：2017-06-23
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Scott Alan GOLD
CPC classification number: B22F3/16 , B22F3/105 , B22F3/1055 , B22F3/164 , B22F2003/1051 , B22F2003/1052 , B22F2003/1056 , B22F2003/1057 , B22F2003/1058 , B22F2998/10 , B23K26/356 , B23K2103/50 , B33Y10/00 , B33Y30/00 , C21D10/005
Abstract: The present disclosure generally relates to methods and apparatuses for laser shock peening during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed microstructural and/or physical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.
-
公开(公告)号：US20170252805A1
公开(公告)日：2017-09-07
申请号：US15059105
申请日：2016-03-02
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Shane Matthew GILLESPIE , James SHEALY , Scott Alan GOLD
Abstract: A method and apparatus for additive manufacturing is provided whereby a curtain of powder is provided adjacent a vertically oriented build plate, and a laser melts or sinters the powder over a region of the build plate. The curtain of powder is moved relative to the build plate to maintain the same distance between the curtain and the previously deposited layer, and the process repeated to provide a three dimensional structure on the build plate.
-
Patent Agency Ranking
公开(公告)号：US20180369912A1
公开(公告)日：2018-12-27
申请号：US15631955
申请日：2017-06-23
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Scott Alan GOLD
IPC: B22F3/105 , B33Y10/00 , B33Y30/00 , B29C67/00 , B28B1/00 , C23C16/50 , B33Y40/00 , B22F7/04 , B22F3/00 , C23C16/04 , C23C16/52 , B23K15/00 , B23K26/342 , B23K26/082
Abstract: The present disclosure generally relates to methods and apparatuses for chemical vapor deposition (CVD) during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed chemical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.
-
公开(公告)号：US20180111334A1
公开(公告)日：2018-04-26
申请号：US15335116
申请日：2016-10-26
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Scott Alan GOLD , Zachary David FIELDMAN , Daniel JOERGER
CPC classification number: B33Y10/00 , B22F3/1055 , B22F5/003 , B22F2003/1058 , B29C64/153 , B29C64/40 , B29L2009/00 , Y02P10/295
Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize thermal dissipation support structures in the process of building objects, as well as novel thermal dissipation support structures to be used within these AM processes. The thermal dissipation support structures include at least one sacrificial structure that is separated from the object by a portion of unfused powder. The sacrificial structure increases a thermal dissipation rate of at least a portion of the object such that such that thermal gradients in the object remain below a specified threshold that prevents deformation of the object.
-
公开(公告)号：US20180370213A1
公开(公告)日：2018-12-27
申请号：US15631965
申请日：2017-06-23
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Scott Alan GOLD , Christian STEVENSON
Abstract: The present disclosure generally relates to methods and apparatuses for secondary material deposition and insert deposition during additive manufacturing (AM) processes. Such methods and apparatuses can be used to embed chemical signatures into manufactured objects, and such embedded chemical signatures may find use in anti-counterfeiting operations and in manufacture of objects with multiple materials.
-
公开(公告)号：US20180029306A1
公开(公告)日：2018-02-01
申请号：US15220170
申请日：2016-07-26
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Scott Alan GOLD , Patrick Michael KENNEY
IPC: B29C67/00
CPC classification number: B33Y50/02 , B22F3/1055 , B22F2003/1057 , B22F2003/1058 , B22F2999/00 , B29C64/153 , B29C64/282 , B29C64/393 , B29L2009/00 , B33Y10/00 , Y02P10/295 , B22F2203/03 , B22F2202/11 , B22F2203/11
Abstract: The present disclosure generally relates to methods for additive manufacturing (AM) that utilize ghost support structure in the process of building objects, as well as novel ghost support structures to be used within these AM processes. The ghost support structures include a portion of powder that is scanned with an energy beam having insufficient power to fuse the powder. The ghost supports control timing of the additive manufacturing process and allow portions of the object to cool to a desired temperature before adjacent portions of the object are scanned.
-
公开(公告)号：US20170246810A1
公开(公告)日：2017-08-31
申请号：US15053881
申请日：2016-02-25
Applicant: GENERAL ELECTRIC COMPANY
Inventor： Scott Alan GOLD
IPC: B29C67/00 , G05B19/4099
Abstract: This invention relates to a method for using a multivariate statistical control process to reduce the variation of an additively manufactured part or object. The invention also relates to a system and software that can be used to implement the method in additive manufacturing devices or apparatuses.
-
-
-
-
-
-
Search Results
7
records
(took 0.011 seconds)
