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公开(公告)号:US20190099807A1
公开(公告)日:2019-04-04
申请号:US15722525
申请日:2017-10-02
Applicant: GENERAL ELECTRIC COMPANY
Inventor: Lucas Christian JONES , Jonathan ORTNER , John MOORES , Patrick KENNEY
Abstract: The present disclosure generally relates to methods and apparatuses for additive manufacturing with improved powder distribution capabilities. Specifically, the methods and apparatuses of the present disclosure incorporate powder distribution vanes to improve the lateral deposition of powder from a hopper. Such methods and apparatuses have the potential to reduce powder overhead costs, mitigate associated health and environmental risks, and increase manufacturing efficiency.
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公开(公告)号:US20190134911A1
公开(公告)日:2019-05-09
申请号:US15807443
申请日:2017-11-08
Applicant: GENERAL ELECTRIC COMPANY
Inventor: Lucas Christian JONES , Justin MAMRAK
IPC: B29C64/393 , G06K9/00 , G06T7/564 , G03F7/20 , G03F7/00 , G06K9/20 , B29C64/153 , B29C64/223 , B22F3/105
Abstract: A method, apparatus, and program for build surface mapping and recovery for additive manufacturing. The method may include fabricating an object by additive manufacturing wherein the topology of a build surface is determined. An additive manufacturing process may be modified based on the topology determination. The topology of the surface may be determined by marking the surface with a first mark using a converging energy source; determining a dimension of the mark using a camera; and determining a height of the first mark based on the dimension of the mark.
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