公开(公告)号：US10384548B2

公开(公告)日：2019-08-20

申请号：US15140812

申请日：2016-04-28

申请人： General Electric Company

发明人： Sarit Ratadiya ,  Ajith Kuttannair Kumar ,  Tharunendra Sekhar ,  Mark Allen Murphy ,  Jacob Alan Hubbell ,  Kevin Ruybal ,  Emil Nikolaev Nikolov

IPC分类号： H02K11/00 ,  B60L11/18 ,  H02J1/00 ,  B60L1/00 ,  B60L50/51 ,  H02J5/00

摘要： A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.

公开(公告)号：USD851601S1

公开(公告)日：2019-06-18

申请号：US29643127

申请日：2018-04-04

申请人： General Electric Company

设计人： Mark Allen Murphy ,  Jeffrey Wolff ,  Jason Kuttenkuler ,  Henry Young

公开(公告)号：USD816619S1

公开(公告)日：2018-05-01

申请号：US29593225

申请日：2017-02-07

申请人： General Electric Company

设计人： Mark Allen Murphy ,  Jeffrey Wolff ,  Jason Kuttenkuler ,  Henry Young

公开(公告)号：USD782981S1

公开(公告)日：2017-04-04

申请号：US29566032

申请日：2016-05-26

申请人： GENERAL ELECTRIC COMPANY

设计人： Mark Allen Murphy ,  Jason Daniel Kuttenkuler ,  Sean Patrick Cillessen ,  Aiqin Jiang

公开(公告)号：USD747683S1

公开(公告)日：2016-01-19

申请号：US29486610

申请日：2014-04-01

申请人： General Electric Company

设计人： Andrew Louis Krivonak ,  Mark Allen Murphy ,  Theodore Clark Brown ,  Frank Dolski ,  Michael Grutkowski

公开(公告)号：USD743912S1

公开(公告)日：2015-11-24

申请号：US29509696

申请日：2014-11-20

申请人： General Electric Company

设计人： Mark Allen Murphy ,  George Wnukoski ,  Jeffrey John Wolff ,  Lindsay Short

公开(公告)号：USD743902S1

公开(公告)日：2015-11-24

申请号：US29510294

申请日：2014-11-26

申请人： General Electric Company

设计人： Mark Allen Murphy ,  Henry Todd Young ,  Jason Daniel Kuttenkuler ,  Jeffrey John Wolff ,  Aiqin Jiang ,  Sean Patrick Cillessen

公开(公告)号：US09648789B2

公开(公告)日：2017-05-09

申请号：US14511441

申请日：2014-10-10

申请人： General Electric Company

发明人： Andrew Louis Krivonak ,  Mark Allen Murphy

IPC分类号： H05K7/20

CPC分类号： H05K7/209

摘要： An apparatus is provided that includes a housing for an electronic device. The housing includes a plurality of side walls and a removable exterior housing panel. A circuit board is mechanically attached to a first side of the panel, which faces an interior of the housing when the panel is secured to the plurality of side walls. The panel is made from a heat-conductive material to conduct heat from the circuit board to the panel and exterior environment.

公开(公告)号：USD784264S1

公开(公告)日：2017-04-18

申请号：US29565989

申请日：2016-05-26

申请人： GENERAL ELECTRIC COMPANY

设计人： Mark Allen Murphy ,  Henry Todd Young ,  Jason Daniel Kuttenkuler ,  Jeffrey John Wolff ,  Sean Patrick Cillessen ,  Aiqin Jiang

公开(公告)号：USD767498S1

公开(公告)日：2016-09-27

申请号：US29542283

申请日：2015-10-13

申请人： General Electric Company

设计人： Aiqin Jiang ,  Theodore Clark Brown ,  Jason Daniel Kuttenkuler ,  Henry Todd Young ,  Gui He ,  Sean Patrick Cillessen ,  Mark Allen Murphy ,  Zhao Zhang