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公开(公告)号:US20100185410A1
公开(公告)日:2010-07-22
申请号:US12354958
申请日:2009-01-16
CPC分类号: G06F19/00 , H01L22/14 , H01L22/20 , H01L25/0657 , H01L25/50 , H01L2225/06513 , H01L2225/06596 , H01L2924/0002 , H01L2924/00
摘要: A three-dimensional (3D) chip is fabricated from components that have been cut out of a two-dimensional (2D) chip to create the layers of the 3D chip. By testing the 2D chip first, the layers of the 3D chip have been pre-tested, thus reducing testing and production costs.
摘要翻译: 三维(3D)芯片由已经从二维(2D)芯片切出的部件制造以产生3D芯片的层。 首先通过测试2D芯片,3D芯片的层已经过预先测试,从而降低了测试和生产成本。
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公开(公告)号:US20100185819A1
公开(公告)日:2010-07-22
申请号:US12355000
申请日:2009-01-16
IPC分类号: G06F12/08
CPC分类号: G06F12/128 , G06F12/0815
摘要: A first cache simultaneously broadcasts, in a single message, a request for a cache line and a request to accept a future related evicted cache line to multiple other caches. Each of the multiple other caches evaluate their occupancy to derive an occupancy value that reflects their ability to accept the future related evicted cache line. In response to receiving a requested cache line, the first cache evicts the related evicted cache line to the cache with the highest occupancy value.
摘要翻译: 第一缓存器在单个消息中同时广播对高速缓存行的请求以及接受未来相关的逐出高速缓存行到多个其他高速缓存的请求。 多个其他缓存中的每一个都评估其占用率,以得出反映其接受未来相关驱逐缓存行的能力的占用值。 响应于接收到所请求的高速缓存行,第一缓存将相关的逐出高速缓存行驱逐到具有最高占用值的高速缓存。
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