Data analyzer, semiconductor manufacturing system, data analysis method, and semiconductor manufacturing method

    公开(公告)号:US11353857B2

    公开(公告)日:2022-06-07

    申请号:US16729990

    申请日:2019-12-30

    Abstract: A data analyzer includes a data collector that acquires data on each analysis target parameter of each of a plurality of apparatuses from the apparatus, the plurality of apparatuses including a light source apparatus, an exposure apparatus that exposes a wafer to pulsed light outputted from the light source apparatus, and a wafer inspection apparatus that inspects the exposed wafer, an image generator that visualizes the data on each of the parameters collected by the data collector from the apparatuses that process the wafer for each predetermined area of the wafer to convert the data into an image and generates a plurality of mapped images for each of the parameters of the apparatuses, and a correlation computing section that performs pattern matching on arbitrary ones of the mapped images generated from the wafer to determine a correlation value between arbitrary ones of the parameters of the apparatuses.

    Laser unit management system
    2.
    发明授权

    公开(公告)号:US10394133B2

    公开(公告)日:2019-08-27

    申请号:US15914299

    申请日:2018-03-07

    Abstract: A laser unit management system may include a server configured to hold first information provided with access limitation that allows an access with a first access authorization, second information provided with access limitation that allows an access with a second access authorization, and third information provided with access limitation that allows both an access with the first access authorization and an access with the second access authorization; and a laser unit including a laser output section and a controller, the laser output section being configured to output pulsed laser light toward an exposure unit that is configured to perform wafer exposure, the controller being configured to store the first information, the second information, and the third information in the server. The second information may include wafer-exposure-related information on the exposure unit and laser-control-related information on the laser unit that are in association with each other.

Patent Agency Ranking