公开(公告)号：US20170131476A1

公开(公告)日：2017-05-11

申请号：US14933668

申请日：2015-11-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Robert K. Leidy ,  Wolfgang Sauter ,  Christopher D. Muzzy ,  Eric Turcotte ,  Thomas E. Lombardi

IPC: G02B6/30 ,  G02B6/13

CPC classification number: G02B6/30 ,  G02B6/13 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/428

Abstract: The disclosure relates to semiconductor structures and, more particularly, to barrier structures for underfill blockout regions uses in phonotics chip packaging and methods of manufacture. The structure includes a substrate with a plurality of solder connections and at least one optical fiber interface disposed within at least one cavity of the substrate. The structure further includes a barrier structure formed about the cavity which is structured to prevent underfill material from degrading an optical coupling of the optical fiber.

公开(公告)号：US09798088B2

公开(公告)日：2017-10-24

申请号：US14933668

申请日：2015-11-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Robert K. Leidy ,  Wolfgang Sauter ,  Christopher D. Muzzy ,  Eric Turcotte ,  Thomas E. Lombardi

IPC: G02B6/30 ,  G02B6/13

CPC classification number: G02B6/30 ,  G02B6/13 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/428

Abstract: The disclosure relates to semiconductor structures and, more particularly, to barrier structures for underfill blockout regions uses in phonotics chip packaging and methods of manufacture. The structure includes a substrate with a plurality of solder connections and at least one optical fiber interface disposed within at least one cavity of the substrate. The structure further includes a barrier structure formed about the cavity which is structured to prevent underfill material from degrading an optical coupling of the optical fiber.