公开(公告)号：US09318584B2

公开(公告)日：2016-04-19

申请号：US14492582

申请日：2014-09-22

Applicant: GLOBALFOUNDRIES INC.

Inventor： Peng Cheng ,  Peter B. Gray ,  Vibhor Jain ,  Robert K. Leidy ,  Qizhi Liu

IPC: H01L29/732 ,  H01L29/66 ,  H01L29/737 ,  H01L21/762

CPC classification number: H01L29/732 ,  H01L21/76229 ,  H01L21/76283 ,  H01L29/66242 ,  H01L29/7378

Abstract: Device structures and design structures for a bipolar junction transistor. The device structure includes a collector region in a substrate, a plurality of isolation structures extending into the substrate and comprised of an electrical insulator, and an isolation region in the substrate. The isolation structures have a length and are arranged with a pitch transverse to the length such that each adjacent pair of the isolation structures is separated by a respective section of the substrate. The isolation region is laterally separated from at least one of the isolation structures by a first portion of the collector region. The isolation region laterally separates a second portion of the collector region from the first portion of the collector region. The device structure further includes an intrinsic base on the second portion of the collector region and an emitter on the intrinsic base. The emitter has a length transversely oriented relative to the length of the isolation structures.

Abstract translation: 双极结型晶体管的器件结构和设计结构。 器件结构包括衬底中的集电极区域，延伸到衬底中并由电绝缘体构成的多个隔离结构以及衬底中的隔离区域。 隔离结构具有长度并且以横向于长度的间距布置，使得每个相邻的一对隔离结构被基板的相应部分分开。 隔离区域通过集电区域的第一部分与隔离结构中的至少一个横向分离。 隔离区域将收集区域的第二部分与收集器区域的第一部分横向分离。 器件结构还包括在集电极区域的第二部分上的本征基极和在本征基极上的发射极。 发射极相对于隔离结构的长度具有横向定向的长度。

公开(公告)号：US09798088B2

公开(公告)日：2017-10-24

申请号：US14933668

申请日：2015-11-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Robert K. Leidy ,  Wolfgang Sauter ,  Christopher D. Muzzy ,  Eric Turcotte ,  Thomas E. Lombardi

IPC: G02B6/30 ,  G02B6/13

CPC classification number: G02B6/30 ,  G02B6/13 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/428

Abstract: The disclosure relates to semiconductor structures and, more particularly, to barrier structures for underfill blockout regions uses in phonotics chip packaging and methods of manufacture. The structure includes a substrate with a plurality of solder connections and at least one optical fiber interface disposed within at least one cavity of the substrate. The structure further includes a barrier structure formed about the cavity which is structured to prevent underfill material from degrading an optical coupling of the optical fiber.

公开(公告)号：US10224276B2

公开(公告)日：2019-03-05

申请号：US15787146

申请日：2017-10-18

Applicant: GLOBALFOUNDRIES INC.

Inventor： Edward C. Cooney, III ,  Jeffrey P. Gambino ,  Zhong-Xiang He ,  Robert K. Leidy

IPC: H01L29/40 ,  H01L23/522 ,  H01L23/525 ,  H01L23/532 ,  H01L23/00 ,  H01L21/768 ,  H01L23/31

Abstract: Various aspects include an integrated circuit (IC), design structure, and a method of making the same. In one embodiment, the IC includes: a substrate; a dielectric layer disposed on the substrate; a set of wire components disposed on the dielectric layer, the set of wire components including a first wire component disposed proximate a second wire component; a bond pad disposed on the first wire component, the bond pad including an exposed portion; a passivation layer disposed on the dielectric layer about a portion of the bond pad and the set of wire components, the passivation layer defining a wire structure via connected to the second wire component; and a wire structure disposed on the passivation layer proximate the bond pad and connected to the second wire component through the wire structure via.

公开(公告)号：US09435948B2

公开(公告)日：2016-09-06

申请号：US14304318

申请日：2014-06-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Robert K. Leidy ,  Mark D. Levy ,  Qizhi Liu ,  Gary L. Milo ,  Steven M. Shank

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/125 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/125 ,  G02B6/136 ,  G02B2006/12061

Abstract: Various embodiments include a silicon-based optical waveguide structure locally on a bulk silicon substrate, and systems and program products for forming such a structure by modifying an integrated circuit (IC) design structure. Embodiments include implementing processes of preparing manufacturing data for formation of the IC design structure in a computer-implemented IC formation system, wherein the preparing of the manufacturing data includes inserting instructions into the manufacturing data to convert an edge of the at least one shape from a crystallographic direction to a crystallographic direction.

Abstract translation: 各种实施例包括局部在体硅衬底上的硅基光波导结构，以及用于通过修改集成电路（IC）设计结构来形成这种结构的系统和程序产品。 实施例包括实现在计算机实现的IC形成系统中准备用于形成IC设计结构的制造数据的过程，其中制造数据的准备包括将指令插入到制造数据中以将至少一种形状的边缘从 <110>结晶方向到<100>晶体方向。

公开(公告)号：US20170131476A1

公开(公告)日：2017-05-11

申请号：US14933668

申请日：2015-11-05

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Robert K. Leidy ,  Wolfgang Sauter ,  Christopher D. Muzzy ,  Eric Turcotte ,  Thomas E. Lombardi

IPC: G02B6/30 ,  G02B6/13

CPC classification number: G02B6/30 ,  G02B6/13 ,  G02B6/4239 ,  G02B6/4243 ,  G02B6/428

Abstract: The disclosure relates to semiconductor structures and, more particularly, to barrier structures for underfill blockout regions uses in phonotics chip packaging and methods of manufacture. The structure includes a substrate with a plurality of solder connections and at least one optical fiber interface disposed within at least one cavity of the substrate. The structure further includes a barrier structure formed about the cavity which is structured to prevent underfill material from degrading an optical coupling of the optical fiber.

公开(公告)号：US20180040556A1

公开(公告)日：2018-02-08

申请号：US15787146

申请日：2017-10-18

Applicant: GLOBALFOUNDRIES INC.

Inventor： Edward C. Cooney, III ,  Jeffrey P. Gambino ,  Zhong-Xiang He ,  Robert K. Leidy

IPC: H01L23/522 ,  H01L23/532 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L23/5226 ,  H01L21/76843 ,  H01L21/76879 ,  H01L21/76885 ,  H01L23/3114 ,  H01L23/3192 ,  H01L23/5227 ,  H01L23/525 ,  H01L23/53238 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/02166 ,  H01L2224/03462 ,  H01L2224/03831 ,  H01L2224/04042 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/12042 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Various aspects include an integrated circuit (IC), design structure, and a method of making the same. In one embodiment, the IC includes: a substrate; a dielectric layer disposed on the substrate; a set of wire components disposed on the dielectric layer, the set of wire components including a first wire component disposed proximate a second wire component; a bond pad disposed on the first wire component, the bond pad including an exposed portion; a passivation layer disposed on the dielectric layer about a portion of the bond pad and the set of wire components, the passivation layer defining a wire structure via connected to the second wire component; and a wire structure disposed on the passivation layer proximate the bond pad and connected to the second wire component through the wire structure via.

公开(公告)号：US09715064B1

公开(公告)日：2017-07-25

申请号：US15263817

申请日：2016-09-13

Applicant: GLOBALFOUNDRIES INC.

Inventor： Jeffrey P. Gambino ,  Robert K. Leidy ,  John J. Ellis-Monaghan ,  Brett T. Cucci ,  Jeffrey C. Maling ,  Jessie C. Rosenberg

IPC: G02B6/124 ,  G02B6/34 ,  G02B6/12

CPC classification number: G02B6/124 ,  G02B6/34 ,  G02B2006/12107

Abstract: Disclosed are multi-chip modules (MCMs) that allow for chip-to-chip transmission of light signals. The MCMs can incorporate at least two components, which are attached (e.g., by interconnects). For example, in one MCM disclosed herein, the two components can be an integrated circuit chip and an interposer to which the integrated circuit chip and one or more additional integrated circuit chips are attached by interconnects. In another MCM disclosed herein, the two components can be two integrated circuit chips that are stacked and attached to each other by interconnects. In either case, the two components can each have a waveguide and a grating coupler coupled to one end of the waveguide. The grating couplers on the different components can be approximately vertically aligned, thereby allowing light signals to be transmitted between the waveguides on those different components. Also, disclosed herein are methods of forming such MCMs.