公开(公告)号：US10712499B2

公开(公告)日：2020-07-14

申请号：US16202037

申请日：2018-11-27

Applicant: GLOBALFOUNDRIES INC.

Inventor： Selaka Bandara Bulumulla ,  Md Sayed Kaysar Bin Rahim ,  Tanya Andreeva Atanasova

IPC: G02B6/12 ,  H01L23/00 ,  G02B6/122 ,  H01L23/522 ,  H01L23/64 ,  H01L49/02 ,  G02B6/13

Abstract: The present disclosure relates to packaging of integrated circuit chips for semiconductor devices. More particularly, the present disclosure relates to packaging of multiple chips for silicon photonics devices. The present disclosure provides a semiconductor device including a photonic integrated circuit (PIC) chip, an inductor positioned over the PIC chip, and a transimpedance amplifier (TIA) chip positioned over the PIC chip. The inductor has a first terminal end and a second terminal end, and the first terminal end is connected to the PIC chip.