公开(公告)号：US09337436B2

公开(公告)日：2016-05-10

申请号：US14736942

申请日：2015-06-11

Applicant: GLOBALFOUNDRIES INC.

Inventor： Keith E. Fogel ,  Jeehwan Kim ,  Devendra K. Sadana ,  Tze-bin Song

IPC: H01L51/48 ,  H01L51/44 ,  H01L51/00 ,  H01L51/42

CPC classification number: H01L51/442 ,  H01L51/0013 ,  H01L51/0021 ,  H01L51/0024 ,  H01L51/0037 ,  H01L51/42 ,  H01L51/445 ,  Y02E10/549 ,  Y02P70/521

Abstract: A method for fabricating a photovoltaic device includes forming an adhesion layer on a substrate, forming a material layer on the adhesion layer and applying release tape to the material layer. The substrate is removed at a weakest interface between the adhesion layer and the substrate by mechanically pulling the release tape to form a transfer substrate including the adhesion layer, the material layer and the release tape. The transfer substrate is transferred to a target substrate to contact the adhesion layer to the target substrate. The transfer substrate includes a material sensitive to formation processes of the transfer substrate such that exposure to the formation processes of the transfer substrate is avoided by the target substrate.