公开(公告)号：US20200279783A1

公开(公告)日：2020-09-03

申请号：US16288152

申请日：2019-02-28

Applicant: GLOBALFOUNDRIES INC. ,  NOVA MEASURING INSTRUMENTS LTD.

Inventor： PADRAIG TIMONEY ,  TAHER KAGALWALA ,  ALOK VAID ,  SRIDHAR MAHENDRAKAR ,  DHAIRYA DIXIT ,  SHAY YOGEV ,  MATTHEW SENDELBACH ,  CHARLES KANG

IPC: H01L21/66 ,  G01N21/956 ,  H01L29/66 ,  G01N21/95

Abstract: Process control during manufacture of semiconductor devices by collecting scatterometric spectra of a FinFET reference fin structure on a reference semiconductor wafer at a first checkpoint proximate to a first processing step during fabrication of the reference semiconductor wafer, collecting reference measurements of the reference fin structure at a second checkpoint proximate to a second processing step subsequent to the first checkpoint, and performing machine learning to identify correspondence between the scatterometric spectra and values based on the reference measurements and train a prediction model for producing a prediction value associated with a corresponding production fin structure of the FinFET on a production semiconductor wafer based on scatterometric spectra of the production fin structure collected at the corresponding first checkpoint during fabrication of the production semiconductor wafer.

公开(公告)号：US20210150387A1

公开(公告)日：2021-05-20

申请号：US16973092

申请日：2019-06-14

Applicant: NOVA MEASURING INSTRUMENTS LTD.

Inventor： EITAN ROTHSTEIN ,  ILYA RUBINOVICH ,  NOAM TAL ,  BARAK BRINGOLTZ ,  YONGHA KIM ,  ARIEL BROITMAN ,  ODED COHEN ,  EYLON RABINOVICH ,  TAL ZAHARONI ,  SHAY YOGEV ,  DANIEL KANDEL

IPC: G06N5/04 ,  G01B11/06 ,  H01L21/66 ,  H01L21/68 ,  G06N20/00 ,  G03F7/20

Abstract: A semiconductor metrology system including a spectrum acquisition tool for collecting, using a first measurement protocol, baseline scatterometric spectra on first semiconductor wafer targets, and for various sources of spectral variability, variability sets of scatterometric spectra on second semiconductor wafer targets, the variability sets embodying the spectral variability, a reference metrology tool for collecting, using a second measurement protocol, parameter values of the first semiconductor wafer targets, and a training unit for training, using the collected spectra and values, a prediction model using machine learning and minimizing an associated loss function incorporating spectral variability terms, the prediction model for predicting values for production semiconductor wafer targets based on their spectra.