公开(公告)号：US08907496B1

公开(公告)日：2014-12-09

申请号：US13909301

申请日：2013-06-04

Applicant: GLOBALFOUNDRIES Inc.

Inventor： GuoXiang Ning ,  Xiang Hu ,  Sarasvathi Thangaraju ,  Paul Ackmann

IPC: H01L21/768 ,  H01L23/522

CPC classification number: H01L23/5226 ,  H01L23/481 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Circuit structures and methods of fabrication are provided with enhanced electrical connection between, for instance, a first metal level and a contact surface of a conductive structure. Enhanced electrical connection is achieved using a plurality of contact vias which are differently-sized, and disposed over and electrically coupled to the contact surface. The differently-sized contact vias include at least one center region contact via disposed over a center region of the contact surface, and at least one peripheral region contact via disposed over a peripheral region of the contact surface, where the at least one center region contact via is larger than the at least one peripheral region contact via.

Abstract translation: 电路结构和制造方法在例如第一金属水平和导电结​​构的接触表面之间提供增强的电连接。 使用多个不同尺寸的接触通孔实现增强的电连接，并且设置在接触表面上并电耦合到接触表面。 不同尺寸的接触通孔包括设置在接触表面的中心区域上的至少一个中心区域接触孔，以及设置在接触表面的周边区域上的至少一个周边区域接触孔，其中该至少一个中心区域接触 通孔大于至少一个周边区域接触通孔。