Abstract:
The present disclosure provides a placing and routing method for implementing back bias in fully depleted silicon-on-insulator. In accordance with some illustrative embodiments herein, the placing and routing method comprises placing a first plurality of a standard tap well cell along a first direction, the standard tap well cell being formed by: routing a p-BIAS wire VPW and an n-BIAS wire VNW in a first a first metallization layer, and routing a power rail and a ground rail in a second metallization layer, the VPW and the VNW extending across each of the power and ground rail, wherein the VPWs of the first plurality of standard tap well cells are continuously connected and the VNWs of the first plurality of standard tap well cells are continuously connected.
Abstract:
The present disclosure provides a placing and routing method for implementing back bias in fully depleted silicon-on-insulator. In accordance with some illustrative embodiments herein, the placing and routing method comprises placing a first plurality of a standard tap well cell along a first direction, the standard tap well cell being formed by: routing a p-BIAS wire VPW and an n-BIAS wire VNW in a first a first metallization layer, and routing a power rail and a ground rail in a second metallization layer, the VPW and the VNW extending across each of the power and ground rail, wherein the VPWs of the first plurality of standard tap well cells are continuously connected and the VNWs of the first plurality of standard tap well cells are continuously connected.
Abstract:
A memory cell includes an inverter loop. The inverter loop includes a plurality of inverter pairs, wherein an output of each inverter pair is connected to an input of a next inverter pair in the loop. Each inverter pair includes a first inverter and a second inverter. An input of the first inverter provides the input of the inverter pair. An output of the second inverter provides the output of the inverter pair. An output of the first inverter is connected to an input of the second inverter. The memory cell further includes a plurality of passgate transistor pairs. Each passgate transistor pair includes a first passgate transistor connected to the input of the first inverter of the inverter pair associated with the passgate transistor pair and a second passgate transistor connected to the input of the second inverter of the inverter pair associated with the passgate transistor pair.