公开(公告)号：US20170235867A1

公开(公告)日：2017-08-17

申请号：US15045466

申请日：2016-02-17

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Thomas Melde ,  Matthias U. Lehr ,  Thomas Herrmann ,  Jens Hassmann ,  Moritz Andreas Meyer ,  Rakesh Kumar Kuncha

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.

公开(公告)号：US09898572B2

公开(公告)日：2018-02-20

申请号：US15045466

申请日：2016-02-17

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Thomas Melde ,  Matthias U. Lehr ,  Thomas Herrmann ,  Jens Hassmann ,  Moritz Andreas Meyer ,  Rakesh Kumar Kuncha

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.