公开(公告)号：US10191112B2

公开(公告)日：2019-01-29

申请号：US15355256

申请日：2016-11-18

Applicant: GLOBALFOUNDRIES INC.

Inventor： Rao Desineni ,  Atul Chittora ,  Yan Pan ,  Sherwin Fernandes ,  Thomas Herrmann

IPC: G01R31/00 ,  G01R31/317 ,  G01R31/3177

Abstract: Disclosed are embodiments of a method that provides for pre-production run development of a fail signature database, which stores fail signatures for systematic defects and corresponding root causes. The fail signatures in the database is subsequently accessed and used for a variety of purposes. For example, the fail signatures are evaluated and, based on the results of the evaluation, actions are taken to prevent specific systematic defects from occurring during production runs and/or to allow for early detection of specific systematic defects during production runs. In some embodiments, following production runs, new fail signatures from failing production chips are developed and compared against the fail signatures in the fail signature database. In some embodiments, when a signature match indicates that a particular production chip has a same systematic defect with a same root cause as a particular prototype chip in-line advanced process control (APC) is performed.

公开(公告)号：US10095826B2

公开(公告)日：2018-10-09

申请号：US15184164

申请日：2016-06-16

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Shikha Somani ,  Sriram Madhavan ,  Thomas Herrmann ,  Stefan Schüler ,  Uwe Schroeder ,  Shobhit Malik ,  Eric Chiu

IPC: G06F17/50

Abstract: A method and apparatus for selecting Si wafer WP based on individual or multiple DFM decks for Si-feed-forward and Si-feed-back analysis are provided. Embodiments include generating markers for a wafer from an individual DFM deck; generating UCF Indexes; determining whether a representative marker corresponding to a UCF is a candidate for WP prediction; extracting markers corresponding to that UCF-Index (UEF data) from a candidate; performing a UCF-Index-based sampling on the extracted UEF data set if a number of markers in the extracted UEF data set is larger than an inspection requirement; adding a location of each marker or group of markers in the extracted UEF data set to a sitelist after the UCF-Index-based sampling; sending the sitelist to a foundry for metrology analysis on sitelist locations; and adding the sitelist locations and corresponding UCF Index and metrology parameters to a design analysis database for analyzing other wafers/UCF Indexes.

公开(公告)号：US09898572B2

公开(公告)日：2018-02-20

申请号：US15045466

申请日：2016-02-17

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Thomas Melde ,  Matthias U. Lehr ,  Thomas Herrmann ,  Jens Hassmann ,  Moritz Andreas Meyer ,  Rakesh Kumar Kuncha

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.

公开(公告)号：US20170235867A1

公开(公告)日：2017-08-17

申请号：US15045466

申请日：2016-02-17

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Thomas Melde ,  Matthias U. Lehr ,  Thomas Herrmann ,  Jens Hassmann ,  Moritz Andreas Meyer ,  Rakesh Kumar Kuncha

IPC: G06F17/50

CPC classification number: G06F17/5077

Abstract: A method of Back-End-Of-Line processing of a semiconductor device is provided including providing a layout for metal lines of a metallization layer of the semiconductor device, determining a semi-isolated metal line in the provided layout and shifting at least a portion of the determined semi-isolated metal line.

公开(公告)号：US20180143248A1

公开(公告)日：2018-05-24

申请号：US15355256

申请日：2016-11-18

Applicant: GLOBALFOUNDRIES INC.

Inventor： Rao Desineni ,  Atul Chittora ,  Yan Pan ,  Sherwin Fernandes ,  Thomas Herrmann

IPC: G01R31/317 ,  G01R31/3177

CPC classification number: G01R31/31703 ,  G01R31/31718 ,  G01R31/3177

Abstract: Disclosed are embodiments of a method that provides for pre-production run development of a fail signature database, which stores fail signatures for systematic defects and corresponding root causes. The fail signatures in the database is subsequently accessed and used for a variety of purposes. For example, the fail signatures are evaluated and, based on the results of the evaluation, actions are taken to prevent specific systematic defects from occurring during production runs and/or to allow for early detection of specific systematic defects during production runs. In some embodiments, following production runs, new fail signatures from failing production chips are developed and compared against the fail signatures in the fail signature database. In some embodiments, when a signature match indicates that a particular production chip has a same systematic defect with a same root cause as a particular prototype chip in-line advanced process control (APC) is performed.

公开(公告)号：US20160162626A1

公开(公告)日：2016-06-09

申请号：US15042779

申请日：2016-02-12

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Thomas Herrmann ,  Stefan Schueler ,  Aravind Narayana Samy

IPC: G06F17/50

CPC classification number: G06F17/5081 ,  G03F1/36 ,  G03F1/70 ,  G03F7/70441 ,  G03F7/705 ,  G03F7/70641 ,  G06F17/5009

Abstract: A method of manufacturing a semiconductor device, comprising providing design data, producing lithography masks based on the design data, predicting a product process window and producing a wafer including semiconductor structures by means of the lithography masks and observing conditions defined by the product process window.

Abstract translation: 一种制造半导体器件的方法，包括提供设计数据，基于设计数据产生光刻掩模，预测产品工艺窗口，并通过光刻掩模和由产品工艺窗口定义的观察条件来生产包括半导体结构的晶片。