公开(公告)号：US20130153927A1

公开(公告)日：2013-06-20

申请号：US13765474

申请日：2013-02-12

Applicant: GLOBALFOUNDRIES, Inc.

Inventor： Bin Yang ,  Man Fai NG

IPC: H01L29/78

CPC classification number: H01L29/7848 ,  H01L29/045 ,  H01L29/165 ,  H01L29/6659 ,  H01L29/66636 ,  H01L29/7833

Abstract: Apparatus for semiconductor device structures and related fabrication methods are provided. One method for fabricating a semiconductor device structure involves forming a gate structure overlying a region of semiconductor material, wherein the width of the gate structure is aligned with a crystal direction of the semiconductor material. The method continues by forming recesses about the gate structure and forming a stress-inducing semiconductor material in the recesses.

Abstract translation: 提供了半导体器件结构和相关制造方法的装置。 制造半导体器件结构的一种方法包括形成覆盖半导体材料区域的栅极结构，其中栅极结构的宽度与半导体材料的<100>晶体方向对齐。 该方法通过在栅极结构周围形成凹槽并在凹部中形成应力诱导半导体材料来继续。

公开(公告)号：US20160260841A1

公开(公告)日：2016-09-08

申请号：US14640757

申请日：2015-03-06

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Bin YANG ,  Man Fai NG

IPC: H01L29/786 ,  H01L27/12

CPC classification number: H01L29/78618 ,  H01L21/76232 ,  H01L21/76283 ,  H01L21/84 ,  H01L27/1203 ,  H01L27/1211 ,  H01L29/66477 ,  H01L29/66545 ,  H01L29/66628 ,  H01L29/66772 ,  H01L29/78 ,  H01L29/78684 ,  H01L29/78696

Abstract: A semiconductor is formed on an SOI substrate, such as an extremely thin SOI (ETSOI) substrate, with increased extension thickness. Embodiments include semiconductor devices having an epitaxially formed silicon-containing layer, such as embedded silicon germanium (eSiGe), on the SOI substrate. An embodiment includes forming an SOI substrate, epitaxially forming a silicon-containing layer on the SOI substrate, and forming a gate electrode on the epitaxially formed silicon-containing layer. After gate spacers and source/drain regions are formed, the gate electrode and underlying silicon-containing layer are removed and replaced with a high-k metal gate. The use of an epitaxially formed silicon-containing layer reduces SOI thickness loss due to fabrication process erosion, thereby increasing extension thickness and lowering extension resistance.