Reusing active area mask for trench transfer exposure
    1.
    发明授权
    Reusing active area mask for trench transfer exposure 有权
    重新使用有源区域掩模进行沟槽转移曝光

    公开(公告)号:US08962485B2

    公开(公告)日:2015-02-24

    申请号:US13897890

    申请日:2013-05-20

    CPC classification number: H01L21/76816 H01L21/28518 H01L27/0207

    Abstract: A method of silicide formation in a semiconductor fabrication process is disclosed. An active area (RX) mask is used to form an active silicon area, and is then reused to form a trench transfer (TT) area. A trench block (TB) mask is logically ANDed with the active area (RX) mask to form a trench silicide (TS) region.

    Abstract translation: 公开了半导体制造工艺中硅化物形成的方法。 使用有源区(RX)掩模形成活性硅区,然后再利用以形成沟槽转移(TT)区。 沟槽块(TB)掩模与有源区(RX)掩模进行逻辑“与”,以形成沟槽硅化物(TS)区域。

    REUSING ACTIVE AREA MASK FOR TRENCH TRANSFER EXPOSURE
    2.
    发明申请
    REUSING ACTIVE AREA MASK FOR TRENCH TRANSFER EXPOSURE 有权
    重新激活活动区域用于TRENCH转移接触

    公开(公告)号:US20140342556A1

    公开(公告)日:2014-11-20

    申请号:US13897890

    申请日:2013-05-20

    CPC classification number: H01L21/76816 H01L21/28518 H01L27/0207

    Abstract: A method of silicide formation in a semiconductor fabrication process is disclosed. An active area (RX) mask is used to form an active silicon area, and is then reused to form a trench transfer (TT) area. A trench block (TB) mask is logically ANDed with the active area (RX) mask to form a trench silicide (TS) region.

    Abstract translation: 公开了半导体制造工艺中硅化物形成的方法。 使用有源区(RX)掩模形成活性硅区,然后再利用以形成沟槽转移(TT)区。 沟槽块(TB)掩模与有源区(RX)掩模进行逻辑“与”,以形成沟槽硅化物(TS)区域。

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