公开(公告)号：US20180203359A1

公开(公告)日：2018-07-19

申请号：US15405448

申请日：2017-01-13

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Sidheswara Mahapatra ,  Wolfram Grundke ,  Heiko Wagner

IPC: G03F7/20 ,  H01L21/67

CPC classification number: G03F7/2041 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/67225

Abstract: The present disclosure relates to techniques for supplying different chemical products to process tools of a manufacturing environment used for micro-processing substrates. To this end, the various types of chemical products may be supplied by providing mobile dispense devices having incorporated therein any required hardware components for dispensing a chemical product. Moreover, the mobile dispense devices are appropriately equipped so as to enable coupling to and removal from respective process tools, such as wafer tracks of modern lithography tools. Due to the mobile or modular nature of the respective chemical product lines, a significant reduction of cost of ownership, increased tool availability and reduced investment costs may be achieved compared to conventional regimes.

公开(公告)号：US10146132B2

公开(公告)日：2018-12-04

申请号：US15405448

申请日：2017-01-13

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Sidheswara Mahapatra ,  Wolfram Grundke ,  Heiko Wagner

IPC: G03B27/42 ,  G03F7/20 ,  H01L21/67

Abstract: The present disclosure relates to techniques for supplying different chemical products to process tools of a manufacturing environment used for micro-processing substrates. To this end, the various types of chemical products may be supplied by providing mobile dispense devices having incorporated therein any required hardware components for dispensing a chemical product. Moreover, the mobile dispense devices are appropriately equipped so as to enable coupling to and removal from respective process tools, such as wafer tracks of modern lithography tools. Due to the mobile or modular nature of the respective chemical product lines, a significant reduction of cost of ownership, increased tool availability and reduced investment costs may be achieved compared to conventional regimes.

公开(公告)号：US10007198B2

公开(公告)日：2018-06-26

申请号：US15176296

申请日：2016-06-08

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Heiko Wagner ,  Sidheswara Mahapatra

IPC: G03F7/20 ,  H01L21/687 ,  H01L21/66 ,  H01L21/67

CPC classification number: G03F7/70775 ,  H01L21/67103 ,  H01L21/6715 ,  H01L21/68707 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20

Abstract: A method includes providing a semiconductor processing system that includes a plurality of units. Each unit has a configuration that defines a predetermined orientation of a wafer that is provided in the unit and includes a plurality of wafer handling elements. An arrangement of the plurality of wafer handling elements of the unit relative to the predetermined orientation of the wafer is adjustable. For each of the plurality of units, the arrangement of the plurality of wafer handling elements of the unit is adjusted relative to the predetermined orientation of the wafer. For each of the plurality of units, an arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer is provided that is different from the arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer in one or more other units of the plurality of units.

公开(公告)号：US20170084475A1

公开(公告)日：2017-03-23

申请号：US15176296

申请日：2016-06-08

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Heiko Wagner ,  Sidheswara Mahapatra

IPC: H01L21/68 ,  H01L21/66 ,  G03F7/20 ,  H01L21/687

CPC classification number: G03F7/70775 ,  H01L21/67103 ,  H01L21/6715 ,  H01L21/68707 ,  H01L21/68742 ,  H01L22/12 ,  H01L22/20

Abstract: A method includes providing a semiconductor processing system that includes a plurality of units. Each unit has a configuration that defines a predetermined orientation of a wafer that is provided in the unit and includes a plurality of wafer handling elements. An arrangement of the plurality of wafer handling elements of the unit relative to the predetermined orientation of the wafer is adjustable. For each of the plurality of units, the arrangement of the plurality of wafer handling elements of the unit is adjusted relative to the predetermined orientation of the wafer. For each of the plurality of units, an arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer is provided that is different from the arrangement of the plurality of wafer handling elements relative to the predetermined orientation of the wafer in one or more other units of the plurality of units.