公开(公告)号：US10146132B2

公开(公告)日：2018-12-04

申请号：US15405448

申请日：2017-01-13

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Sidheswara Mahapatra ,  Wolfram Grundke ,  Heiko Wagner

IPC: G03B27/42 ,  G03F7/20 ,  H01L21/67

Abstract: The present disclosure relates to techniques for supplying different chemical products to process tools of a manufacturing environment used for micro-processing substrates. To this end, the various types of chemical products may be supplied by providing mobile dispense devices having incorporated therein any required hardware components for dispensing a chemical product. Moreover, the mobile dispense devices are appropriately equipped so as to enable coupling to and removal from respective process tools, such as wafer tracks of modern lithography tools. Due to the mobile or modular nature of the respective chemical product lines, a significant reduction of cost of ownership, increased tool availability and reduced investment costs may be achieved compared to conventional regimes.

公开(公告)号：US20180203359A1

公开(公告)日：2018-07-19

申请号：US15405448

申请日：2017-01-13

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Sidheswara Mahapatra ,  Wolfram Grundke ,  Heiko Wagner

IPC: G03F7/20 ,  H01L21/67

CPC classification number: G03F7/2041 ,  H01L21/67017 ,  H01L21/6719 ,  H01L21/67225

Abstract: The present disclosure relates to techniques for supplying different chemical products to process tools of a manufacturing environment used for micro-processing substrates. To this end, the various types of chemical products may be supplied by providing mobile dispense devices having incorporated therein any required hardware components for dispensing a chemical product. Moreover, the mobile dispense devices are appropriately equipped so as to enable coupling to and removal from respective process tools, such as wafer tracks of modern lithography tools. Due to the mobile or modular nature of the respective chemical product lines, a significant reduction of cost of ownership, increased tool availability and reduced investment costs may be achieved compared to conventional regimes.

公开(公告)号：US09798244B2

公开(公告)日：2017-10-24

申请号：US14943086

申请日：2015-11-17

Applicant: GLOBALFOUNDRIES Inc.

Inventor： Arthur Hotzel ,  Philipp Jaschinsky ,  Remi Riviere ,  Wolfram Grundke

IPC: G03F1/50 ,  G03F1/70 ,  G03F7/20

CPC classification number: G03F7/70325 ,  G03F1/36 ,  G03F1/50 ,  G03F1/70

Abstract: Methods, apparatus, and system for minimizing defectivity in top-coat-free immersion photolithography are provided. Embodiments include forming a photomask by defining a first pattern including a main functional pattern in the photomask; and defining a second pattern including a sub-resolution fill pattern in the photomask in areas between or and/or within structures of the first pattern, the fill pattern having a pitch or range of pitches smaller than a minimum resolved pitch of the lithographic exposure and/or at least a part of the sub-resolution structures of the sub-resolution fill pattern not substantially modifying an imaging of any structure of the main functional pattern in the lithographic exposure.