公开(公告)号：US11105846B1

公开(公告)日：2021-08-31

申请号：US16838439

申请日：2020-04-02

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Nicholas A. Polomoff ,  Dirk Breuer ,  Eric D. Hunt-Schroeder ,  Bernhard J Wunder ,  Dewei Xu

IPC: G01R31/28

Abstract: Embodiments of the disclosure provide a system for detecting and monitoring a crack in an integrated circuit (IC), including: at least one electrically conductive perimeter line (PLINE) extending about, and electrically isolated from, a protective structure formed in an inactive region of the IC, wherein an active region of the IC is enclosed within the protective structure; a circuit for sensing a change in an electrical characteristic of the at least one PLINE, the change in the electrical characteristic indicating a presence of a crack in the inactive region of the IC; and a connecting structure for electrically coupling each PLINE to the sensing circuit.

公开(公告)号：US20210118796A1

公开(公告)日：2021-04-22

申请号：US16654059

申请日：2019-10-16

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Dirk Breuer ,  Oliver M. Witnik ,  Carla Byloos ,  Holger S. Schuehrer

IPC: H01L23/522 ,  H01L23/532 ,  H01L21/768 ,  H01L23/528

Abstract: Disclosed are embodiments of a back end of the line (BEOL) metal structure that includes, within a metal level, a metal via, which has at least eight sides and all interior angles at 135° or more, and a metal wire thereon. The metal wire and via include respective portions of a continuous conformal metal layer. A passivation layer coats the top surface of the metal layer. The metal via and the metal wire thereon can be in an upper metal level and can be made of one metal (e.g., aluminum or an aluminum alloy). The upper metal level can be above a lower metal level that similarly includes a metal via and metal wire thereon, but the metal used can be different (e.g., copper) and/or the shape of the via can be different (e.g., four-sided). Also disclosed herein are method embodiments for forming the above-described BEOL metal structure.

公开(公告)号：US11127674B2

公开(公告)日：2021-09-21

申请号：US16654059

申请日：2019-10-16

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Dirk Breuer ,  Oliver M. Witnik ,  Carla Byloos ,  Holger S. Schuehrer

IPC: H01L23/522 ,  H01L23/532 ,  H01L21/768 ,  H01L23/528

Abstract: Disclosed are embodiments of a back end of the line (BEOL) metal structure that includes, within a metal level, a metal via, which has at least eight sides and all interior angles at 135° or more, and a metal wire thereon. The metal wire and via include respective portions of a continuous conformal metal layer. A passivation layer coats the top surface of the metal layer. The metal via and the metal wire thereon can be in an upper metal level and can be made of one metal (e.g., aluminum or an aluminum alloy). The upper metal level can be above a lower metal level that similarly includes a metal via and metal wire thereon, but the metal used can be different (e.g., copper) and/or the shape of the via can be different (e.g., four-sided). Also disclosed herein are method embodiments for forming the above-described BEOL metal structure.