公开(公告)号：US11587888B2

公开(公告)日：2023-02-21

申请号：US16713709

申请日：2019-12-13

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Asli Sahin ,  Thomas F. Houghton ,  Jennifer A. Oakley ,  Jeremy S. Alderman ,  Karen A. Nummy ,  Zhuojie Wu

IPC: G02B6/42 ,  H01L23/00 ,  G02B6/12

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.

公开(公告)号：US11810870B2

公开(公告)日：2023-11-07

申请号：US18146039

申请日：2022-12-23

Applicant: GlobalFoundries U.S. Inc.

Inventor： Asli Sahin ,  Thomas F. Houghton ,  Jennifer A. Oakley ,  Jeremy S. Alderman ,  Karen A. Nummy ,  Zhuojie Wu

IPC: G02B6/42 ,  H01L23/00 ,  G02B6/12

CPC classification number: H01L23/564 ,  G02B6/4243 ,  G02B6/4248 ,  G02B6/4251 ,  H01L23/562 ,  G02B6/12 ,  G02B2006/12061

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to a moisture seal for photonic devices and methods of manufacture. The structure includes: a first trench in at least one substrate material; a guard ring structure with an opening and which at least partially surrounds the first trench; and a second trench at a dicing edge of the substrate, the second trench being lined on sidewalls with barrier material and spacer material over the barrier material.