公开(公告)号：US09351398B2

公开(公告)日：2016-05-24

申请号：US13857011

申请日：2013-04-04

Applicant: GM Global Technology Operations LLC

Inventor： Lisa M. Albaugh ,  David A. Smith ,  Timothy J. Guse

IPC: C09D11/52 ,  C09D11/037 ,  H05K1/09 ,  H05K3/12

CPC classification number: H05K1/095 ,  C09D11/037 ,  C09D11/52 ,  H05K3/1233 ,  H05K3/1291 ,  Y10T428/31678

Abstract: Thick film conductive inks for electronic devices, methods for making electronic devices using thick film conductive inks, and electronic devices fabricated by such methods are provided herein. In one example, a thick film conductive ink includes an organic portion and an inorganic portion. The inorganic portion is dispersed in the organic portion to define a paste. The inorganic portion includes metallic copper powder, cupric oxide, and elemental boron. The thick film conductive ink includes substantially no glass.

Abstract translation: 本发明提供电子器件用厚膜导电油墨，使用厚膜导电油墨制造电子器件的方法以及通过这些方法制造的电子器件。 在一个实例中，厚膜导电油墨包括有机部分和无机部分。 无机部分分散在有机部分中以形成糊状物。 无机部分包括金属铜粉，氧化铜和元素硼。 厚膜导电油墨基本上不包括玻璃。

公开(公告)号：US20160297977A1

公开(公告)日：2016-10-13

申请号：US14680200

申请日：2015-04-07

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Lisa M. Albaugh ,  David A. Smith ,  Timothy J. Guse

IPC: C09D11/03 ,  H01B3/12 ,  H01B3/08 ,  C09K5/10

CPC classification number: C09D11/03 ,  C09D11/037 ,  C09D11/14 ,  C09D11/52 ,  C09K5/10 ,  H01B3/08 ,  H01B3/12

Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

Abstract translation: 用于电子器件的导热厚膜电介质油墨包括有机介质，玻璃粘合剂和具有分散在整个厚膜电介质油墨混合物中的陶瓷颗粒的工业陶瓷粉末的混合物。

公开(公告)号：US10113073B2

公开(公告)日：2018-10-30

申请号：US14680200

申请日：2015-04-07

Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC

Inventor： Lisa M. Albaugh ,  David A. Smith ,  Timothy J. Guse

IPC: C09D11/03 ,  H01B3/12 ,  H01B3/08 ,  C09K5/10 ,  C09D11/037 ,  C09D11/14 ,  C09D11/52

Abstract: A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.