公开(公告)号：US20240151576A1

公开(公告)日：2024-05-09

申请号：US18417006

申请日：2024-01-19

Applicant: GOERTEK MICROELECTRONICS INC.

Inventor： Luyu Duanmu ,  Junyu Tian ,  Huabin Fang

IPC: G01H11/08

CPC classification number: G01H11/08 ,  H04R7/00 ,  H04R2201/003

Abstract: Disclosed are a vibration sensor and an electronic equipment. The vibration sensor includes a circuit board assembly, a shell, a vibration pick-up assembly, a support shell and a chip assembly. The shell is configured to cover a side of the circuit board assembly to form an installation space. The vibration pick-up assembly is provided in the installation space, and is configured to pick up an external bone vibration and generate a response vibration. The support shell is connected to a side of the vibration pick-up assembly away from the circuit board assembly. The chip assembly is connected to a side of the support shell away from the circuit board assembly, and is electrically connected to the circuit board assembly. The vibration pick-up assembly, the support shell and the chip assembly are enclosed to form a conduction cavity.