Abstract:
In one general aspect, an apparatus can include a base component including a keyed mount receptacle, and a power component including a keyed mount configured to be inserted into the keyed mount receptacle. The power component can be configured to be lockably coupled to the base component when the power component is rotated with respect to the base component.
Abstract:
According to an example embodiment, an electrical connector may include an electrical cord comprising a plurality of wires, and a plug connected to the electrical cord. The plug may include electrical contacts coupled to the plurality of electrical wires, and at least one latch. The at least one latch may be biased to extend away from the plug, an end surface of the at least one latch being within two tenths of a millimeter of an end surface of the plug opposite from the electrical cord.
Abstract:
An electronic device includes a first housing of a single piece of material that has first and second spaced apart major walls that extend in lateral directions and at least three side walls extending perpendicular to the lateral directions between the major walls. The major walls and the side walls define an internal cavity, and the first housing defines an opening to the internal cavity opposite one of the side walls. At least one support member is within the internal cavity of the first housing adjacent a major walls a side wall thereof. At least one electronic component is contained within the internal cavity, and a first cover is removably affixed over the opening. At least one of the support member and the first cover contributes to a retention force applied on the at least one electronic component within the internal cavity of the first housing.
Abstract:
In accordance with aspects of the disclosure, a device may include a base member formed as a receptacle with a recess defining an interior region configured for receiving internal circuitry. The base member may include first and second sides intersecting orthogonally to define a corner. The device may include a rail member having a first portion coupled to the first side of the base member and a second portion coupled to the second side of the base member. The rail member may be positioned to contact the corner of the base member. The device may include an enclosing member coupled to the first and second portions of the rail member with a plurality of fasteners to thereby enclose the internal circuitry disposed in the recess of the base member between the enclosing member and the base member.
Abstract:
In one general aspect, an apparatus can include a display portion, a base frame coupled to the display portion where the base frame includes a channel defined by a top wall opposite a bottom wall and a side wall coupled to the top wall and to the bottom wall. The side wall can have an outer surface defining at least a portion of an outer perimeter of the base frame. The channel can have a first portion on a first side of the base frame and a second portion on a second side of the base frame opposite the first side of the base frame. The apparatus can include a midplane having a first edge disposed in the first portion of the channel and having a second edge disposed in the second portion of the channel.
Abstract:
A method includes forming an assembly of a first part of a computing device enclosure and a second part of the computing device enclosure by disposing a thermoplastic adhesive layer between a surface portion of the first part and an opposing surface portion of the second part. The surface portion of the first part and the opposing surface portion of the second part define one or more bonding areas of the first part and the second part across a lateral extent of the assembly. The assembly has a non-uniform thermal mass distribution across its lateral extent. The method further includes applying spatially varying amounts of heat to the assembly across its lateral extent to soften the thermoplastic adhesive layer in the bonding areas relatively uniformly across the lateral extent of the assembly compared to applying a non-spatially varying amount of heat across the lateral extent of the assembly.