PHOTONIC FLEXIBLE INTERCONNECT
    1.
    发明申请
    PHOTONIC FLEXIBLE INTERCONNECT 审中-公开
    光电柔性互连

    公开(公告)号:US20130230274A1

    公开(公告)日:2013-09-05

    申请号:US13412441

    申请日:2012-03-05

    CPC classification number: G02B6/421 G02B6/1221 G02B6/305

    Abstract: Embodiments of the invention describe a silicon photonic interconnect, formed from an SOI substrate, having a waveguide for receiving optical data from an integrated circuit. Said photonic interconnect may comprise a flexible interconnect including a polymer layer disposed on the SOI substrate. Said photonic interconnect may include an optical fiber component to send/receive optical data to/from optical components or devices.The waveguide of the silicon photonic interconnect may be formed for butt or evanescent coupling to the integrated circuit, may include an optical grating for coupling to the integrated circuit, or may include an etched taper for providing an adiabatic transition to a waveguide of the integrated circuit. The optical fiber interconnect component may be a taper to create large, fiber matched mode sizes or v-groove arrangements to enable alignment of optical fibers, or may include vertical couplers or evanescent couplers mode matched to optical fibers or fiber receptacles.

    Abstract translation: 本发明的实施例描述了由SOI衬底形成的硅光子互连,其具有用于从集成电路接收光学数据的波导。 所述光子互连可以包括柔性互连,其包括设置在SOI衬底上的聚合物层。 所述光子互连可以包括用于向/从光学部件或设备发送/接收光学数据的光纤部件。 硅光子互连的波导可以形成用于与集成电路的对接或者渐逝耦合,可以包括用于耦合到集成电路的光栅,或者可以包括用于提供对集成电路的波导的绝热过渡的蚀刻锥形 。 光纤互连部件可以是锥形,以产生大的光纤匹配模式尺寸或V形槽布置,以使得光纤对准,或者可以包括与光纤或光纤插座匹配的垂直耦合器或渐逝耦合器模式。

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