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公开(公告)号:US20170328747A1
公开(公告)日:2017-11-16
申请号:US15533193
申请日:2015-11-24
Applicant: Grundfos Holding A/S
Inventor: Kjeld Winther JACOBSEN , John B. JACOBSEN , Mikkel HAUGAARD
CPC classification number: G01D11/245 , G01L13/025 , G01L19/14 , G12B9/04
Abstract: A sensor arrangement includes a sensor which is arranged in a housing constructed of two plastic injection molded parts (2, 3). The electrical leads are sealingly led through the housing (1) and are sealed by way of O-rings which on the one hand bear in a groove of the lead and on the other hand bear in a recess forming the housing feed-through.
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公开(公告)号:US20230299646A1
公开(公告)日:2023-09-21
申请号:US18012697
申请日:2021-07-17
Applicant: GRUNDFOS HOLDING A/S
Inventor: Mikkel HAUGAARD , Steen MIKKELSEN
CPC classification number: H02K11/33 , H02K5/18 , H02K5/207 , H02K9/06 , H02K9/227 , H02K11/40 , H02K2211/03
Abstract: A pump motor (1) includes a rotor (2) mounted to a drive shaft (3) extending along a rotor axis (L). The rotor (2) is circumferentially embraced by a stator. A stator housing (5), encloses the stator. The stator housing includes a first axial end and a second axial end. Electronics for powering and controlling the motor operation include a first portion, arranged on a first PCB, and a second portion, arranged on a second PCB (51). A first electronics housing (11) accommodates the first PCB. The first electronics housing (11) is arranged at a perimeter of the stator housing (5). A second electronics housing (47) accommodates the second PCB (51). The second electronics housing (47) is arranged at the second axial end of the stator housing (5). The second electronics housing (47) at least partially rings the drive shaft (3).
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公开(公告)号:US20170328746A1
公开(公告)日:2017-11-16
申请号:US15533183
申请日:2015-08-28
Applicant: Grundfos Holding A/S
Inventor: Kjeld Winther JACOBSEN , John B. JACOBSEN , Mikkel HAUGAARD
CPC classification number: G01D11/245 , G12B9/04
Abstract: A sensor arrangement includes at least one sensor (7) as well as a housing (1) constructed of at least two plastic injection molded parts (2, 3), and a sensor electronics which are located on the circuit board (5) and which is secured by this housing. At least one absorption body (4) is provided within the housing (1) and is designed as a plastic injection molded part and serves for absorbing fluid which could get into the housing by diffusion.
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