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公开(公告)号：US20060114657A1
公开(公告)日：2006-06-01
申请号：US10999269
申请日：2004-11-29
申请人： Gamal Refai-Ahmed , Xiaohua Sun , Nima Osqueizadeh , Salim Lakhani , Jim Loro , A. Mei Lan Shepherd-Murray , Ross Lau
发明人： Gamal Refai-Ahmed , Xiaohua Sun , Nima Osqueizadeh , Salim Lakhani , Jim Loro , A. Mei Lan Shepherd-Murray , Ross Lau
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.
摘要翻译： 本公开涉及一种用于管理安装到诸如电子或光学部件的电路基板的部件的温度的热管理装置。 该装置包括散热结构，其包括从散热结构的表面延伸的至少一个突起。 还包括载体结构并与散热结构接合。 载体结构包括容纳至少一个突起的孔。 另外，该装置包括至少一个偏置结构，其被配置为允许散热结构相对于载体结构的移动，并且提供倾向于将散热结构和载体结构移动到一起的偏置力。
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公开(公告)号：US07283364B2
公开(公告)日：2007-10-16
申请号：US10999269
申请日：2004-11-29
申请人： Gamal Refai-Ahmed , Xiaohua H. Sun , Nima Osqueizadeh , Salim Lakhani , Jim E. Loro , A. Mei Lan Shepherd-Murray , Ross Lau
发明人： Gamal Refai-Ahmed , Xiaohua H. Sun , Nima Osqueizadeh , Salim Lakhani , Jim E. Loro , A. Mei Lan Shepherd-Murray , Ross Lau
CPC分类号： G06F1/20 , H01L23/4006 , H01L23/467 , H01L2023/405 , H01L2023/4062 , H01L2023/4081 , H01L2924/0002 , H01L2924/00
摘要： The present disclosure relates to a thermal management apparatus used to manage temperature of components mounted to a circuit substrate, such as electronic or optical components. The apparatus includes a heat dissipation structure that includes at least one protrusion extending from a surface of the heat dissipation structure. A carrier structure is also included and engages with the heat dissipation structure. The carrier structure includes an aperture that receives the at least one protrusion. Additionally, the apparatus includes at least one biasing structure that is configured to allow movement of the heat dissipation structure relative to the carrier structure and provides a biasing force tending to move the heat dissipation structure and carrier structure together.
摘要翻译： 本公开涉及一种用于管理安装到诸如电子或光学部件的电路基板的部件的温度的热管理装置。 该装置包括散热结构，其包括从散热结构的表面延伸的至少一个突起。 还包括载体结构并与散热结构接合。 载体结构包括容纳至少一个突起的孔。 另外，该装置包括至少一个偏置结构，其被配置为允许散热结构相对于载体结构的移动，并且提供倾向于将散热结构和载体结构移动到一起的偏置力。
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公开(公告)号：US20070047211A1
公开(公告)日：2007-03-01
申请号：US11162163
申请日：2005-08-31
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.
摘要翻译： 将热管理装置热耦合到电路基板的至少一个发热部件的装置包括至少第一部分，其适于耦合到热管理装置，以及至少第二部分，其适于耦合到 热管理装置。 第一部分和第二部分可以相对于彼此对称地布置。 第一部分和第二部分适于使热管理装置以第一弹簧偏压热耦合到发热部件。 第一部分和第二部分还适于将热管理装置与第二弹簧偏压热耦合到发热部件。
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公开(公告)号：US07570490B2
公开(公告)日：2009-08-04
申请号：US11162163
申请日：2005-08-31
CPC分类号： H01L23/4093 , H01L2924/0002 , H01L2924/00
摘要： A device to thermally couple a thermal management apparatus to at least one heat generating component of a circuit substrate includes at least a first portion that is adapted to couple to the thermal management apparatus, and at least a second portion that is adapted to couple to the thermal management apparatus. The first portion and the second portion may be symmetrically arranged relative to each other. The first portion and the second portion are adapted to thermally couple the thermal management apparatus to the heat generating component with a first spring bias. The first portion and the second portion are further adapted to maintain the thermal management apparatus thermally coupled to the heat generating component with a second spring bias.
摘要翻译： 将热管理装置热耦合到电路基板的至少一个发热部件的装置包括至少第一部分，其适于耦合到热管理装置，以及至少第二部分，其适于耦合到 热管理装置。 第一部分和第二部分可以相对于彼此对称地布置。 第一部分和第二部分适于使热管理装置以第一弹簧偏压热耦合到发热部件。 第一部分和第二部分还适于将热管理装置与第二弹簧偏压热耦合到发热部件。
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公开(公告)号：US20080253087A1
公开(公告)日：2008-10-16
申请号：US11733586
申请日：2007-04-10
IPC分类号： H05K7/20
CPC分类号： F04D25/08 , F04D25/082 , G06F1/206 , H05K7/20727
摘要： A configurable multiple inlet thermal management device, such as an air-mover or passive heat sink, for electronic devices. The thermal management device is arranged on a computing device or on a component of a computing device or similar, such as an expansion module or alike, so that incoming air flow decreases the temperature of the heat producing components. In order to provide best possible air flow the air-mover comprises blade design that pressurizes the air flow from at least one side of the air-mover component. The air-mover includes removable covers for providing the openings required for intake air from the desired direction and for providing a fan wind. Depending on the application the openings may be permanently opened or closed. The intake air flow is then directed in form of fan wind towards the heat producing elements.
摘要翻译： 用于电子设备的可配置的多入口热管理装置，例如空气推动器或被动散热器。 热管理装置布置在计算设备上或计算设备或类似部件的组件上，例如扩展模块或类似物，使得进入的空气流量降低了发热部件的温度。 为了提供最佳可能的空气流动，空气推动器包括对来自促动器部件的至少一侧的空气流加压的叶片设计。 空气推动器包括可移除的盖，用于提供从所需方向进入的空气所需的开口和用于提供风扇风。 根据应用，开口可以永久地打开或关闭。 然后将进气流以风扇风的形式引向发热元件。
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