-
1.发明申请公开(公告)号：US20090014433A1
公开(公告)日：2009-01-15
申请号：US11776340
申请日：2007-07-11
IPC分类号： H05B1/02
CPC分类号： G05B13/02 , G06F1/206 , G06F1/26 , H01L2924/0002 , H01L2924/00
摘要： A method and system for inducing augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The system is then reliably initialized by applying full system power and triggering a defined initialization sequence/procedure. Once the component is operational, the component's temperature is maintained above the minimum operating threshold via continued self-heating, continued augmentation of the applied DC voltage, or both, as is required.
摘要翻译： 通过利用静态IC泄漏电流来控制大功率器件的温度来引起增加的散热水平的方法和系统。 热控制和温度监测系统（HCTMS）利用热传感器来感测部件的结温，由于在部件供电时由于组件固有的静态泄漏电流而变得自加热。 通过增加电源的电压水平，这种静态自热特性得到增强，这有助于加速器件的预热，直到温度升高到零件的最小规定工作温度以上。 然后通过应用全系统功率并触发定义的初始化序列/过程，可靠地初始化系统。 一旦组件运行，组件的温度通过持续自加热，持续增加所施加的直流电压或两者，保持在最小工作阈值以上，如所需要的那样。
-
2.发明申请METHOD FOR PRE-HEATING HIGH POWER DEVICES TO ENABLE LOW TEMPERATURE START-UP AND OPERATION 失效用于预热高功率器件以实现低温启动和操作的方法公开(公告)号：US20090018708A1
公开(公告)日：2009-01-15
申请号：US11776353
申请日：2007-07-11
IPC分类号： G05D23/32
CPC分类号： H01L23/345 , G05D23/1919 , G05D23/20 , G06F1/206 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A method and system for utilizing the heat dissipated by quiescent IC leakage currents to control the start-up temperature of components. A temperature control sub-system utilizes a thermal sensor to sense the junction temperature of the component. When the temperature is below an operating threshold, the control sub-system applies power to the component, and the component is self-heated due to the quiescent leakage current inherent to the component. This quiescent self-heating property serves as a source of pre-heat to elevate the temperature of the component, until the temperature, as indicated by the thermal sensor, rises above the minimum specified operating temperature of the component. The system may then be reliably initialized by applying full system power, and triggering a hardware reset or defined initialization sequence/procedure. Once the component(s) is operational, self-heating continues to maintain the component's temperature above the minimum operating threshold.
摘要翻译： 一种利用静态IC漏电流消散的热量来控制元件起动温度的方法和系统。 温度控制子系统利用热传感器来感测部件的结温。 当温度低于运行阈值时，控制子系统对部件施加功率，而组件由于组件固有的静态泄漏电流而自加热。 这种静态自加热性能用作预热源，以提升部件的温度，直到由热传感器所指示的温度升高到部件的最小规定工作温度以上。 然后可以通过应用全系统功率可靠地初始化系统，并触发硬件复位或定义的初始化序列/过程。 一旦部件运行，自加热继续保持部件的温度高于最低工作阈值。
-
3.发明授权公开(公告)号：US08378271B2
公开(公告)日：2013-02-19
申请号：US11776340
申请日：2007-07-11
IPC分类号： H05B1/02
CPC分类号： G05B13/02 , G06F1/206 , G06F1/26 , H01L2924/0002 , H01L2924/00
摘要： A method and system for inducing augmented levels of heat dissipation by exploiting quiescent IC leakage currents to control the temperature in high power devices. A heat control and temperature monitoring system (HCTMS) utilizes a thermal sensor to sense the junction temperature of a component, which becomes self-heated due to the quiescent leakage current inherent to the component upon the application of power to the component. By increasing the voltage level of the power source, this quiescent self-heating property is augmented, which serves to accelerate the preheating of the device, until the temperature rises above the minimum specified operating temperature of the component. The system is then reliably initialized by applying full system power and triggering a defined initialization sequence/procedure. Once the component is operational, the component's temperature is maintained above the minimum operating threshold via continued self-heating, continued augmentation of the applied DC voltage, or both, as is required.
摘要翻译： 通过利用静态IC泄漏电流来控制大功率器件的温度来引起增加的散热水平的方法和系统。 热控制和温度监测系统（HCTMS）利用热传感器来感测部件的结温，由于在部件供电时由于组件固有的静态泄漏电流而变得自加热。 通过增加电源的电压水平，这种静态自热特性得到增强，这有助于加速器件的预热，直到温度升高到零件的最小规定工作温度以上。 然后通过应用全系统功率并触发定义的初始化序列/过程，可靠地初始化系统。 一旦组件运行，组件的温度通过持续自加热，持续增加所施加的直流电压或两者，保持在最小工作阈值以上，如所需要的那样。
-
4.发明授权Method for pre-heating high power devices to enable low temperature start-up and operation 失效用于预热大功率器件以实现低温启动和操作的方法公开(公告)号：US08086358B2
公开(公告)日：2011-12-27
申请号：US11776353
申请日：2007-07-11
CPC分类号： H01L23/345 , G05D23/1919 , G05D23/20 , G06F1/206 , H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： A method and system for utilizing the heat dissipated by quiescent IC leakage currents to control the start-up temperature of components. A temperature control sub-system utilizes a thermal sensor to sense the junction temperature of the component. When the temperature is below an operating threshold, the control sub-system applies power to the component, and the component is self-heated due to the quiescent leakage current inherent to the component. This quiescent self-heating property serves as a source of pre-heat to elevate the temperature of the component, until the temperature, as indicated by the thermal sensor, rises above the minimum specified operating temperature of the component. The system may then be reliably initialized by applying full system power, and triggering a hardware reset or defined initialization sequence/procedure. Once the component(s) is operational, self-heating continues to maintain the component's temperature above the minimum operating threshold.
摘要翻译： 一种利用静态IC漏电流消散的热量来控制元件起动温度的方法和系统。 温度控制子系统利用热传感器来感测部件的结温。 当温度低于运行阈值时，控制子系统对部件施加功率，而组件由于组件固有的静态泄漏电流而自加热。 这种静态自加热性能用作预热源，以提升部件的温度，直到由热传感器所指示的温度升高到部件的最小规定工作温度以上。 然后可以通过应用全系统功率可靠地初始化系统，并触发硬件复位或定义的初始化序列/过程。 一旦部件运行，自加热继续保持部件的温度高于最低工作阈值。
-
-
-
搜索结果
4 条记录 (耗时 0.016 秒)
