公开(公告)号：US07633757B2

公开(公告)日：2009-12-15

申请号：US11932103

申请日：2007-10-31

申请人： Gary Gustine ,  Charles G. Ham ,  Michael Sawyer ,  Fredrick A. Daniels ,  Michelle Bishop ,  Lane King ,  Matthew J. Kusz

发明人： Gary Gustine ,  Charles G. Ham ,  Michael Sawyer ,  Fredrick A. Daniels ,  Michelle Bishop ,  Lane King ,  Matthew J. Kusz

IPC分类号： H05K7/20

CPC分类号： H05K7/20409 ,  H04Q1/035 ,  H04Q1/09 ,  H04Q2201/06 ,  H04Q2201/10 ,  H04Q2201/12 ,  H05K7/20418 ,  H05K7/20445

摘要： An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

公开(公告)号：US06862180B2

公开(公告)日：2005-03-01

申请号：US10155050

申请日：2002-05-24

申请人： Michael Sawyer ,  Matthew J. Kusz ,  Gary Gustine ,  Charles G. Ham ,  Fredrick A. Daniels

发明人： Michael Sawyer ,  Matthew J. Kusz ,  Gary Gustine ,  Charles G. Ham ,  Fredrick A. Daniels

IPC分类号： H05K5/06 ,  H05K7/20

CPC分类号： H05K7/20445 ,  H05K5/061 ,  H05K5/063

摘要： A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

摘要翻译： 提供电路卡的外壳。 外壳有一个外壳。 与外壳一体的导热衬套将壳体的内部排列。 衬套的突起延伸穿过壳体并接触壳体，以在衬套和壳体之间形成压力密封。 散热器设置在壳体的外表面上并且热耦合到衬套的突出部。 壳体设置在衬套内并与衬套热耦合。 该情况适于接收多个电路卡，使得多个电路卡热耦合到壳体。