摘要:
Ultrasonic imaging apparatus and method are described for reducing the flash artifact in ultrasonic harmonic images. Harmonic signals are separated by pulse inversion separation which uses multiple transmit pulses which may be subject to motion artifacts. The motion artifacts are detected and subtracted from the harmonic signals to produce harmonic images with reduced flash artifacts. The motion artifacts may also be reduced by notch filtering. In another embodiment the amount of motion in the image is detected and the flash artifact is reduced in accordance with the detected motion. The amount of artifact signal which is removed is variable in accordance with anticipated image motion or clinical application.
摘要:
An ultrasonic imaging system uses a wide bandwidth transducer to transmit multiple simultaneous beams. The beams occupy different frequency bands of the transducer bandwidth and are steered in different beam directions. The received beams are separated by bandpass filters tuned to the different frequency bands. If the different frequency bands overlap, cross-talk between the two beams may be reduced by using coded pulses for the transmit beams and matched filters to separate the received echo signals of the simultaneous beams. a single crystal transducer is used as the wide bandwidth transducer.
摘要:
An ultrasonic diagnostic imaging system includes a predetermined TGC characteristic which is automatically selected or calculated at the initiation of a diagnostic procedure. An automatic TGC circuit analyzes current image data to calculate an adjustment to the predetermined TGC characteristic when activated by the clinician. The ultrasound system produces a displayed TGC curve which illustrates the predetermined TGC characteristic as modified by automatic adjustment and any manual refinement done by the clinician. In a preferred embodiment automatic TGC modification is accompanied by automatic overall gain and dynamic range adjustment to automatically optimize image quality.
摘要:
A method for forming a semiconductor die and a flip-chip integrated circuit device are disclosed that include a power and ground mesh that is oriented diagonally. A layout of a semiconductor die is formed by generating a first integrated circuit design and copying and rotating the design so as to form three additional integrated circuit design blocks. The power and ground mesh layer includes four overlying sets of power and ground strips that are oriented diagonally and symmetric. Because the power and ground strips of the present invention are angled and correspond to the underlying integrated circuit design, they allow for powering both rotated and non-rotated logic while maintaining identical interconnection points and capacitive loading across all the repeated blocks. In addition, the angled power and ground strips allow for easily coupling power and ground to structures around the periphery of the power and ground strips.