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公开(公告)号：US20100296817A1
公开(公告)日：2010-11-25
申请号：US12629650
申请日：2009-12-02
申请人： Chris K. Togami , Gary Sasser , Frank Flens
发明人： Chris K. Togami , Gary Sasser , Frank Flens
CPC分类号： G02B6/43 , G02B6/4246 , G02B6/4292 , H05K9/0058
摘要： Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.
摘要翻译： 用于光电子模块的电磁辐射（EMR）容纳组件。 在一个示例性实施例中，EMR容纳组件包括附接到EMR屏蔽的EMR屏蔽和安装弹簧板。 EMR屏蔽包括限定至少一个边缘的第一基本上平坦的主体，限定在第一主体中的多个光学端口; 以及沿着所述第一主体的至少一个边缘限定的多个手指。 指状物构造成偏压光电子模块的壳体。 安装弹簧板包括限定至少一个边缘的第二基本上平坦的主体，限定在第二主体中的光学窗口，以及沿着第二主体的至少一个边缘限定的多个板簧。 板簧构造成偏压位于光电子模块内的对准引导件。
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公开(公告)号：US07455463B2
公开(公告)日：2008-11-25
申请号：US11145268
申请日：2005-06-02
申请人： Chris K. Togami , Paul Rosenberg , Gary Sasser
发明人： Chris K. Togami , Paul Rosenberg , Gary Sasser
CPC分类号： G02B6/4292 , G02B6/4246 , G02B6/4277
摘要： Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.
摘要翻译： 本发明的实施例涉及光收发器模块的高密度阵列。 第一制造的封装包括光源和/或光检测器，具有用于传送光信号的至少一个开口的第一表面和第二相对表面。 第二制造包装具有用于接纳部件插入件的开口，并且被定向成使得第二制造包装的长度基本上垂直于第二相对表面。 引线框架机械连接第一制造封装和第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械地耦合到第二制造的封装并且电耦合到暴露的触点，使得部件插件的部件可以与光源和/或光检测器电互操作。
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公开(公告)号：US07264408B2
公开(公告)日：2007-09-04
申请号：US11116693
申请日：2005-04-27
申请人： Chris K. Togami , Gary Sasser
发明人： Chris K. Togami , Gary Sasser
IPC分类号： G02B6/36
CPC分类号： G02B6/4292 , G02B6/4204 , G02B6/4246
摘要： Embodiments of the present invention are directed to a modular optical device for sending and/or receiving optical signals. A lens block is configured to mechanically couple to one or more lens pins and to a molded package. A molded package, including at least one of a light source and a light detector and including a connection portion manufactured for direct mechanical and electrical coupling of the molded package to a substrate, is mechanically coupled to the lens block. At least one lens pin for directing an optical signal between a light source or light detector and corresponding external components is coupled to the lens block. The modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
摘要翻译： 本发明的实施例涉及用于发送和/或接收光信号的模块化光学装置。 透镜块被配置为机械地耦合到一个或多个透镜销和模制封装。 包括光源和光检测器中的至少一个并且包括被制造用于将模制封装件直接机械和电耦合到基板的连接部分的模制封装机械地耦合到透镜块。 用于在光源或光检测器和对应的外部部件之间引导光信号的至少一个透镜销耦合到透镜块。 模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此，一个或多个光学连接被集成在主机设备或系统内。
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4.发明授权Dual stage modular optical devices with insert digital diagnostics component 有权具有插入数字诊断部件的双级模块化光学器件公开(公告)号：US07284916B2
公开(公告)日：2007-10-23
申请号：US11151900
申请日：2005-06-13
申请人： Gary Sasser , Chris K. Togami
发明人： Gary Sasser , Chris K. Togami
CPC分类号： G02B6/4292 , G02B6/4204 , G02B6/423 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of the present invention are directed to dual stage modular optical devices with insert digital diagnostics components. A first portion of a leadframe couples a first fabricated package including a light source and/or light detector to a second fabricated package with first opening for receiving inserts. A second portion of the leadframe couples the second fabricated package to a third fabricated package with a second opening for receiving inserts. A first component insert is coupled to the second fabricated package such that components of the first component insert can electrically interoperate with the light source and/or light detector. A second component insert is coupled to the third fabricated package such that components of the second component insert can electrically interoperate with components of the first component insert to implement digital diagnostics functions.
摘要翻译： 本发明的实施例涉及具有插入式数字诊断部件的双级模块化光学装置。 引线框的第一部分将包括光源和/或光检测器的第一制造封装与用于接收插入件的第一开口耦合到第二制造封装。 引线框架的第二部分将第二制造封装耦合到具有用于接收插入件的第二开口的第三制造封装。 第一部件插入件耦合到第二制造封装，使得第一部件插入件的部件可以与光源和/或光检测器电互操作。 第二部件插入件耦合到第三制造的封装，使得第二部件插入件的部件可以与第一部件插入件的部件电互操作以实现数字诊断功能。
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5.发明授权公开(公告)号：US07410307B2
公开(公告)日：2008-08-12
申请号：US11146432
申请日：2005-06-06
申请人： Gary Sasser , Chris K. Togami , Peter E. Campbell
发明人： Gary Sasser , Chris K. Togami , Peter E. Campbell
CPC分类号： G02B6/4206 , G02B6/4246 , G02B6/4292
摘要： Embodiments of the present invention are directed to modular optical devices compatible with multiple fiber connectors. A lens block is configured such that one or more lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package that includes light transmitting and/or detecting components. At least one lens pin has a fiber stop configured to accept a fiber end prepared for use with a first type of fiber connector. A fiber stop disk alters the configuration of the lens pin such that the lens pin can compatibly accept a fiber end prepared for use with a second different type of fiber connector not withstanding that the fiber stop is configured to accept a fiber end prepared for use with the first type of fiber connector.
摘要翻译： 本发明的实施例涉及与多个光纤连接器兼容的模块化光学装置。 透镜块被配置为使得一个或多个透镜引脚可以机械地耦合到透镜块，并且使得透镜块可以机械地耦合到包括光透射和/或检测部件的制造的封装。 至少一个透镜销具有被配置为接受准备用于第一类型的光纤连接器的光纤端的光纤停止件。 光纤停止盘改变透镜销的配置，使得透镜销可以兼容地接受准备用于与第二种不同类型的光纤连接器一起使用的光纤端，而不是将光纤停止件配置为接受准备用于与 第一种类型的光纤连接器。
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公开(公告)号：US07334948B2
公开(公告)日：2008-02-26
申请号：US11135835
申请日：2005-05-23
申请人： Gary Sasser , Chris K. Togami , David Allouche
发明人： Gary Sasser , Chris K. Togami , David Allouche
CPC分类号： G02B6/4201 , G02B6/4246 , G02B6/4292
摘要： Embodiments of the present invention are directed to a modular optical device with a component insert for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or the light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts for electrical interoperation with the light source and/or the light detector to transfer optical signals. The modular optical device can be coupled to a substrate configured to be received within a standard host system slot.
摘要翻译： 本发明的实施例涉及一种具有用于发送和/或接收光信号的部件插入件的模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造包装包括用于接受电路的开口。 引线框架将第一制造的封装机械地连接到第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械耦合到第二制造的封装并电耦合到暴露的触点，用于与光源和/或光检测器的电互操作以传送光信号。 模块化光学设备可以耦合到被配置为被接收在标准主机系统时隙内的基板。
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公开(公告)号：US07805084B2
公开(公告)日：2010-09-28
申请号：US11134532
申请日：2005-05-20
申请人： Chris K. Togami , Gary Sasser
发明人： Chris K. Togami , Gary Sasser
IPC分类号： H04B10/00
CPC分类号： H04B10/40 , G02B6/3897
摘要： Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.
摘要翻译： 本发明的实施例涉及用于发送和/或接收光信号的双级模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造的封装包括用于接受与光源和/或光检测器电互操作以传送光信号的电路的开口。 引线框架将第一制造的封装机械地连接到第二制造的封装并将光源和/或光检测器电连接到暴露在开口中的触点。 双级模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此，一个或多个光学连接被集成在主机设备或系统内。
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8.发明授权Communications module with a shell assembly having thermal mechanical features 有权具有壳体组件的通信模块具有热机械特性公开(公告)号：US08920048B2
公开(公告)日：2014-12-30
申请号：US13116591
申请日：2011-05-26
申请人： Chris K. Togami , Frank J. Flens , Tat Ming Teo
发明人： Chris K. Togami , Frank J. Flens , Tat Ming Teo
CPC分类号： G02B6/4246 , G02B6/4272 , G02B6/4278 , G02B6/428 , G02B6/4281 , G02B6/4292
摘要： In an embodiment, a shell assembly for a communications module is described that includes a top shell, a bottom shell, and a thermal boss. The top shell has a top panel and opposing lateral side portions. The bottom shell has a bottom panel and opposing lateral side portions. The top shell and the bottom shell are configured to be assembled together to define a cavity therebetween. The cavity may be configured to receive a transceiver assembly. The thermal boss extends from the top panel and includes a thermal interface surface defining a thermal interface plane oriented at an angle relative to the top panel.
摘要翻译： 在一个实施例中，描述了一种用于通信模块的壳体组件，其包括顶部壳体，底部壳体和热凸台。 顶壳具有顶板和相对的侧边部分。 底壳具有底板和相对的侧边部分。 顶壳和底壳被构造成组装在一起以在其间限定空腔。 空腔可以被配置为接收收发器组件。 热凸台从顶板延伸并且包括限定相对于顶板成一角度定向的热界面的热界面。
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公开(公告)号：US20110081119A1
公开(公告)日：2011-04-07
申请号：US12717352
申请日：2010-03-04
申请人： Chris K. Togami , Gary D. Sasser , Frank Flens
发明人： Chris K. Togami , Gary D. Sasser , Frank Flens
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/3885 , G02B6/424 , G02B6/4246 , G02B6/4253 , G02B6/428 , G02B6/4281 , G02B6/4284
摘要： One embodiment includes a connector comprising a connector housing, a ferrule, and a crimp ring. The connector housing has inner and outer surfaces extending between forward and rear ends of the connector housing. The inner surfaces defined a passageway extending lengthwise between the forward and rear ends. The connector housing includes at least one protrusion formed on one of the outer surfaces that is configured to engage a corresponding connector engaging structure of an alignment guide to secure the connector housing within the alignment guide. The ferrule is configured to mount upon end portions of a plurality of optical fibers of a multi-fiber communication cable. The ferrule is disposed partially within the passageway. The crimp ring encompasses the rear end of the connector housing and is configured to secure the connector to the multi-fiber communication cable.
摘要翻译： 一个实施例包括连接器，其包括连接器壳体，套圈和压接环。 连接器壳体具有在连接器壳体的前端和后端之间延伸的内表面和外表面。 内表面限定了在前端和后端之间纵向延伸的通道。 连接器壳体包括形成在一个外表面上的至少一个突出部，其被构造成与对准引导件的对应的连接器接合结构接合，以将连接器壳体固定在对准引导件内。 套圈构造成安装在多纤维通信电缆的多个光纤的端部上。 套圈部分地设置在通道内。 压接环包围连接器壳体的后端，并且被配置为将连接器固定到多光纤通信电缆。
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公开(公告)号：US07245498B2
公开(公告)日：2007-07-17
申请号：US11093647
申请日：2005-03-30
CPC分类号： H05K1/144 , G02B6/4246 , G02B6/4292 , H05K1/147 , H05K2201/10303 , H05K2201/10424
摘要： An optical transceiver module that includes an enclosure within which are disposed a transmitter module and a receiver module. A primary and secondary board are disposed as well in the enclosure, and the transmitter module and the receiver module are each connected with one of the boards. The primary and secondary boards each have a ground plane, and a third ground plane is provided by a ground signal plate that disposed within the enclosure and electrically coupled with the primary board and the secondary board.
摘要翻译： 一种光收发器模块，包括其中设置有发射器模块和接收器模块的外壳。 主板和副板也被安置在外壳中，并且发射器模块和接收器模块各自与一个板相连。 主板和次板各自具有接地平面，并且第三接地平面由设置在外壳内并与主板和次板电连接的接地信号板提供。
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