公开(公告)号：US07455463B2

公开(公告)日：2008-11-25

申请号：US11145268

申请日：2005-06-02

申请人： Chris K. Togami ,  Paul Rosenberg ,  Gary Sasser

发明人： Chris K. Togami ,  Paul Rosenberg ,  Gary Sasser

IPC分类号： G02B6/36 ,  H04B10/00

CPC分类号： G02B6/4292 ,  G02B6/4246 ,  G02B6/4277

摘要： Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.

摘要翻译： 本发明的实施例涉及光收发器模块的高密度阵列。 第一制造的封装包括光源和/或光检测器，具有用于传送光信号的至少一个开口的第一表面和第二相对表面。 第二制造包装具有用于接纳部件插入件的开口，并且被定向成使得第二制造包装的长度基本上垂直于第二相对表面。 引线框架机械连接第一制造封装和第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械地耦合到第二制造的封装并且电耦合到暴露的触点，使得部件插件的部件可以与光源和/或光检测器电互操作。

公开(公告)号：US07805084B2

公开(公告)日：2010-09-28

申请号：US11134532

申请日：2005-05-20

申请人： Chris K. Togami ,  Gary Sasser

发明人： Chris K. Togami ,  Gary Sasser

IPC分类号： H04B10/00

CPC分类号： H04B10/40 ,  G02B6/3897

摘要： Embodiments of the present invention are directed to a dual stage modular optical device for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry that is to electrically interoperate with the light source and/or light detector to transfer optical signals. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or light detector to contacts exposed in the opening. The dual stage modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.

摘要翻译： 本发明的实施例涉及用于发送和/或接收光信号的双级模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造的封装包括用于接受与光源和/或光检测器电互操作以传送光信号的电路的开口。 引线框架将第一制造的封装机械地连接到第二制造的封装并将光源和/或光检测器电连接到暴露在开口中的触点。 双级模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此，一个或多个光学连接被集成在主机设备或系统内。

公开(公告)号：US07284916B2

公开(公告)日：2007-10-23

申请号：US11151900

申请日：2005-06-13

申请人： Gary Sasser ,  Chris K. Togami

发明人： Gary Sasser ,  Chris K. Togami

IPC分类号： G02B6/36 ,  H04B10/00

CPC分类号： G02B6/4292 ,  G02B6/4204 ,  G02B6/423 ,  H01L2924/0002 ,  H01L2924/00

摘要： Embodiments of the present invention are directed to dual stage modular optical devices with insert digital diagnostics components. A first portion of a leadframe couples a first fabricated package including a light source and/or light detector to a second fabricated package with first opening for receiving inserts. A second portion of the leadframe couples the second fabricated package to a third fabricated package with a second opening for receiving inserts. A first component insert is coupled to the second fabricated package such that components of the first component insert can electrically interoperate with the light source and/or light detector. A second component insert is coupled to the third fabricated package such that components of the second component insert can electrically interoperate with components of the first component insert to implement digital diagnostics functions.

摘要翻译： 本发明的实施例涉及具有插入式数字诊断部件的双级模块化光学装置。 引线框的第一部分将包括光源和/或光检测器的第一制造封装与用于接收插入件的第一开口耦合到第二制造封装。 引线框架的第二部分将第二制造封装耦合到具有用于接收插入件的第二开口的第三制造封装。 第一部件插入件耦合到第二制造封装，使得第一部件插入件的部件可以与光源和/或光检测器电互操作。 第二部件插入件耦合到第三制造的封装，使得第二部件插入件的部件可以与第一部件插入件的部件电互操作以实现数字诊断功能。

公开(公告)号：US07410307B2

公开(公告)日：2008-08-12

申请号：US11146432

申请日：2005-06-06

申请人： Gary Sasser ,  Chris K. Togami ,  Peter E. Campbell

发明人： Gary Sasser ,  Chris K. Togami ,  Peter E. Campbell

IPC分类号： G02B6/36 ,  H04B10/00

CPC分类号： G02B6/4206 ,  G02B6/4246 ,  G02B6/4292

摘要： Embodiments of the present invention are directed to modular optical devices compatible with multiple fiber connectors. A lens block is configured such that one or more lens pins can mechanically couple to the lens block and such that the lens block can mechanically couple to a fabricated package that includes light transmitting and/or detecting components. At least one lens pin has a fiber stop configured to accept a fiber end prepared for use with a first type of fiber connector. A fiber stop disk alters the configuration of the lens pin such that the lens pin can compatibly accept a fiber end prepared for use with a second different type of fiber connector not withstanding that the fiber stop is configured to accept a fiber end prepared for use with the first type of fiber connector.

摘要翻译： 本发明的实施例涉及与多个光纤连接器兼容的模块化光学装置。 透镜块被配置为使得一个或多个透镜引脚可以机械地耦合到透镜块，并且使得透镜块可以机械地耦合到包括光透射和/或检测部件的制造的封装。 至少一个透镜销具有被配置为接受准备用于第一类型的光纤连接器的光纤端的光纤停止件。 光纤停止盘改变透镜销的配置，使得透镜销可以兼容地接受准备用于与第二种不同类型的光纤连接器一起使用的光纤端，而不是将光纤停止件配置为接受准备用于与 第一种类型的光纤连接器。

公开(公告)号：US07334948B2

公开(公告)日：2008-02-26

申请号：US11135835

申请日：2005-05-23

申请人： Gary Sasser ,  Chris K. Togami ,  David Allouche

发明人： Gary Sasser ,  Chris K. Togami ,  David Allouche

IPC分类号： G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4201 ,  G02B6/4246 ,  G02B6/4292

摘要： Embodiments of the present invention are directed to a modular optical device with a component insert for sending and/or receiving optical signals. A first fabricated package includes a light source for generating optical signals and/or a light detector for detecting received optical signals. A second fabricated package includes an opening for accepting circuitry. A lead frame mechanically connects the first fabricated package to the second fabricated package and electrically connects the light source and/or the light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts for electrical interoperation with the light source and/or the light detector to transfer optical signals. The modular optical device can be coupled to a substrate configured to be received within a standard host system slot.

摘要翻译： 本发明的实施例涉及一种具有用于发送和/或接收光信号的部件插入件的模块化光学装置。 第一制造的封装包括用于产生光信号的光源和/或用于检测接收到的光信号的光检测器。 第二制造包装包括用于接受电路的开口。 引线框架将第一制造的封装机械地连接到第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械耦合到第二制造的封装并电耦合到暴露的触点，用于与光源和/或光检测器的电互操作以传送光信号。 模块化光学设备可以耦合到被配置为被接收在标准主机系统时隙内的基板。

公开(公告)号：US20100296817A1

公开(公告)日：2010-11-25

申请号：US12629650

申请日：2009-12-02

申请人： Chris K. Togami ,  Gary Sasser ,  Frank Flens

发明人： Chris K. Togami ,  Gary Sasser ,  Frank Flens

IPC分类号： H04B10/00 ,  H05K9/00 ,  G02B6/36

CPC分类号： G02B6/43 ,  G02B6/4246 ,  G02B6/4292 ,  H05K9/0058

摘要： Electromagnetic radiation (EMR) containment assemblies for use in optoelectronic modules. In one example embodiment, an EMR containment assembly includes an EMR shield and a mounting spring plate attached to the EMR shield. The EMR shield includes a first substantially flat body defining at least one edge, a plurality of optical ports defined in the first body; and a plurality of fingers defined along at least one edge of the first body. The fingers are configured to bias against a housing of an optoelectronic module. The mounting spring plate includes a second substantially flat body defining at least one edge, an optical window defined in the second body, and a plurality of leaf springs defined along at least one edge of the second body. The leaf springs are configured to bias against an alignment guide positioned within the optoelectronic module.

摘要翻译： 用于光电子模块的电磁辐射（EMR）容纳组件。 在一个示例性实施例中，EMR容纳组件包括附接到EMR屏蔽的EMR屏蔽和安装弹簧板。 EMR屏蔽包括限定至少一个边缘的第一基本上平坦的主体，限定在第一主体中的多个光学端口; 以及沿着所述第一主体的至少一个边缘限定的多个手指。 指状物构造成偏压光电子模块的壳体。 安装弹簧板包括限定至少一个边缘的第二基本上平坦的主体，限定在第二主体中的光学窗口，以及沿着第二主体的至少一个边缘限定的多个板簧。 板簧构造成偏压位于光电子模块内的对准引导件。

公开(公告)号：US07264408B2

公开(公告)日：2007-09-04

申请号：US11116693

申请日：2005-04-27

申请人： Chris K. Togami ,  Gary Sasser

发明人： Chris K. Togami ,  Gary Sasser

IPC分类号： G02B6/36

CPC分类号： G02B6/4292 ,  G02B6/4204 ,  G02B6/4246

摘要： Embodiments of the present invention are directed to a modular optical device for sending and/or receiving optical signals. A lens block is configured to mechanically couple to one or more lens pins and to a molded package. A molded package, including at least one of a light source and a light detector and including a connection portion manufactured for direct mechanical and electrical coupling of the molded package to a substrate, is mechanically coupled to the lens block. At least one lens pin for directing an optical signal between a light source or light detector and corresponding external components is coupled to the lens block. The modular optical device can be coupled to a substrate configured to be received within a standard slot of a host system, such as a PCI or PCMCIA slot. Thus, one or more optical connections are integrated within the host device or system.

摘要翻译： 本发明的实施例涉及用于发送和/或接收光信号的模块化光学装置。 透镜块被配置为机械地耦合到一个或多个透镜销和模制封装。 包括光源和光检测器中的至少一个并且包括被制造用于将模制封装件直接机械和电耦合到基板的连接部分的模制封装机械地耦合到透镜块。 用于在光源或光检测器和对应的外部部件之间引导光信号的至少一个透镜销耦合到透镜块。 模块化光学器件可以耦合到被配置为被接收在诸如PCI或PCMCIA插槽的主机系统的标准槽内的衬底。 因此，一个或多个光学连接被集成在主机设备或系统内。

公开(公告)号：US20050286906A1

公开(公告)日：2005-12-29

申请号：US11145268

申请日：2005-06-02

申请人： Chris Togami ,  Paul Rosenberg ,  Gary Sasser

发明人： Chris Togami ,  Paul Rosenberg ,  Gary Sasser

IPC分类号： H04B10/00

CPC分类号： G02B6/4292 ,  G02B6/4246 ,  G02B6/4277

摘要： Embodiments of the present invention are directed to high density arrays of optical transceiver modules. A first fabricated package includes a light source and/or light detector, a first surface with at least one opening for transferring optical signals, and a second opposing surface. A second fabricated package has an opening for accepting a component insert and is oriented such that the length of the second fabricated package is essentially perpendicular to the second opposing surface. A lead frame mechanically connects the first fabricated package and the second fabricated package and electrically connects the light source and/or light detector in the first fabricated package to contacts exposed in the opening of the second fabricated package. A component insert is mechanically coupled to the second fabricated package and electrically coupled to the exposed contacts such that components of the component insert can electrically interoperate with the light source and/or light detector.

摘要翻译： 本发明的实施例涉及光收发器模块的高密度阵列。 第一制造的封装包括光源和/或光检测器，具有用于传送光信号的至少一个开口的第一表面和第二相对表面。 第二制造包装具有用于接纳部件插入件的开口，并且被定向成使得第二制造包装的长度基本上垂直于第二相对表面。 引线框架机械连接第一制造封装和第二制造封装，并将第一制造封装中的光源和/或光检测器电连接到暴露在第二制造封装的开口中的触点。 部件插入件机械地耦合到第二制造的封装并且电耦合到暴露的触点，使得部件插件的部件可以与光源和/或光检测器电互操作。

公开(公告)号：US20050281515A1

公开(公告)日：2005-12-22

申请号：US11125918

申请日：2005-05-10

申请人： Chris Togami ,  Gary Sasser ,  Rudolf Hofmeister ,  Paul Rosenberg ,  Frank Levinson ,  Axel Mehnert

发明人： Chris Togami ,  Gary Sasser ,  Rudolf Hofmeister ,  Paul Rosenberg ,  Frank Levinson ,  Axel Mehnert

IPC分类号： G02B6/36 ,  G02B6/42

CPC分类号： G02B6/4204 ,  G02B6/423 ,  G02B6/4246

摘要： The principles of the present invention relate to aligning optical components with three degrees of translational freedom. A lens pin, a lens base, and a molded package are aligned in a first direction, a second direction, and a third direction such that the signal strength of optical signals transferred between a lens included in the lens pin and the molded package is optimized. The lens pin is mechanically coupled to the lens base to fix the position of the lens relative to the molded package in the first direction. Subsequently, the lens base and the molded package are realigned in the second and third directions such that the signal strength is again optimized. The lens base is mechanically coupled to the molded package to fix the position of the lens base relative to the molded package in the second and third directions.

摘要翻译： 本发明的原理涉及将具有三个平移自由度的光学部件对准。 透镜销，透镜基座和模制封装在第一方向，第二方向和第三方向上对准，使得在包括在透镜销的透镜和模制封装之间传输的光信号的信号强度被优化 。 透镜销被机械联接到透镜基座，以在第一方向上固定透镜相对于模制包装的位置。 随后，透镜基座和模制封装在第二和第三方向上重新对准，使得信号强度再次被优化。 透镜基座机械耦合到模制封装件，以在第二和第三方向上固定透镜基座相对于模制封装件的位置。

公开(公告)号：US20050018177A1

公开(公告)日：2005-01-27

申请号：US10924135

申请日：2004-08-23

申请人： Paul Rosenberg ,  Gary Sasser ,  Chris Togami ,  Donald Ice

发明人： Paul Rosenberg ,  Gary Sasser ,  Chris Togami ,  Donald Ice

IPC分类号： G02B6/42 ,  G01B11/26

CPC分类号： G02B6/4292 ,  G02B6/42 ,  G02B6/4246

摘要： Methods for assembly of optical transceivers. In one example, the method is performed in connection with an optical transceiver that includes a transmitter optical subassembly and a receiver optical subassembly, as well as structure that defines a pair of ports with which the transmitter optical subassembly and receiver optical subassembly, respectively, are to be aligned. This example of the method involves positioning the transmitter optical subassembly and the receiver optical subassembly in a desired position relative to each other. The transmitter optical subassembly and the receiver optical subassembly are then fixed in the desired position. Next, the transmitter optical subassembly is aligned with one of the ports, and the receiver optical subassembly is aligned with the other port. The alignment of both the transmitter optical subassembly and the receiver optical subassembly with their respective ports is performed in a single operation.

摘要翻译： 装配光收发器的方法。 在一个示例中，该方法与包括发射机光学子组件和接收机光学子组件的光收发器相关联地执行，以及限定一对端口的结构，发射器光学子组件和接收器光学子组件分别与哪个端口 要对齐 该方法的该示例涉及将发射器光学子组件和接收器光学子组件相对于彼此定位在期望位置。 然后将发射机光学子组件和接收器光学子组件固定在期望的位置。 接下来，发射机光学子组件与其中一个端口对准，并且接收机光学子组件与另一个端口对准。 发射机光学子组件和接收器光学子组件与它们各自的端口的对准在一个操作中执行。