High speed electronic assembly system and method
    1.
    发明授权
    High speed electronic assembly system and method 失效
    高速电子组装系统及方法

    公开(公告)号:US06572702B1

    公开(公告)日:2003-06-03

    申请号:US09745324

    申请日:2000-12-21

    IPC分类号: B05C1100

    摘要: Aspects of the present invention are directed to methods and apparatus for producing substrates, including printed circuit boards, in production lines. In one aspect, the present invention provides a production system, a plurality of production lines, wherein machines from one of the lines may be used to replace machines in one of the other lines. In another aspect, the present invention provides a printing system for use in circuit board production lines. The printing system includes a first printer, a second printer and a transfer station. In another aspect, the present invention provides a dispensing system for use is production lines. The dispensing system includes a shuttle conveyor system that allows parallel processing on multiple circuit boards.

    摘要翻译: 本发明的方面涉及生产线中用于制造包括印刷电路板的基底的方法和装置。 一方面,本发明提供了一种生产系统,多条生产线,其中来自一条生产线的机器可用于替代其它生产线之一的机器。 另一方面,本发明提供一种用于电路板生产线的印刷系统。 打印系统包括第一打印机,第二打印机和传送站。 另一方面,本发明提供一种用于生产线的分配系统。 分配系统包括允许在多个电路板上并行处理的梭式输送机系统。