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公开(公告)号:US07470386B2
公开(公告)日:2008-12-30
申请号:US11111076
申请日:2005-04-20
CPC分类号: B29C59/002 , C08K5/0016
摘要: The invention is directed to a polymer shim and a roll-to-roll process for its manufacture.
摘要翻译: 本发明涉及用于其制造的聚合物垫片和卷对卷方法。
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2.
公开(公告)号:US07304780B2
公开(公告)日:2007-12-04
申请号:US11281208
申请日:2005-11-15
申请人: John Hanan Liu , Gary Y. M. Kang , Yi-Shung Chaug
发明人: John Hanan Liu , Gary Y. M. Kang , Yi-Shung Chaug
IPC分类号: G02F1/03 , G02F1/1333 , G02F1/1339 , G02B26/00 , G09G3/34 , G09G3/12
CPC分类号: G02F1/167
摘要: The present invention relates to a backplane design for display panels and processes for their manufacture. The invention provides cost-effective ways to manufacture a display panel because the manufacture does not involve the use of a patterned ITO substrate, flexible printed circuit board or rigid circuit board. In addition, a roll-to-roll process can be employed to manufacture the display panel.
摘要翻译: 本发明涉及用于显示面板的背板设计及其制造方法。 本发明提供了制造显示面板的成本有效的方法,因为制造不涉及使用图案化的ITO基板,柔性印刷电路板或刚性电路板。 此外,可以采用卷对卷工艺来制造显示面板。
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公开(公告)号:US08576162B2
公开(公告)日:2013-11-05
申请号:US11364843
申请日:2006-02-27
申请人: Gary Y. M. Kang , Ryne M. H. Shen , Fei Wang , Yi-Shung Chaug
发明人: Gary Y. M. Kang , Ryne M. H. Shen , Fei Wang , Yi-Shung Chaug
CPC分类号: G02F1/167 , G02F1/134327 , G02F1/1345 , G02F2201/42
摘要: The present invention relates to design and processes for the manufacture of backplane for segment displays. The process comprises: a) forming conductive lines on a non-conductive substrate layer; b) covering the conductive lines with a photoimageable material; c) forming conductive areas connected to the conductive lines and embedded in the photoimageable material; d) plating a conductive material over the photoimageable material to form segment electrodes; and e) optionally filling gaps between said segment electrodes with a thermal or radiation curable material followed by hardening said thermal or radiation curable material.
摘要翻译: 本发明涉及用于制造用于段显示器的背板的设计和工艺。 该方法包括:a)在非导电基底层上形成导线; b)用可光成像的材料覆盖导电线; c)形成连接到导电线并且嵌入可光成像材料中的导电区域; d)在光致成像材料上镀覆导电材料以形成段电极; 以及e)任选地用所述段或电极之间的间隙填充热可辐射固化材料,然后硬化所述热可辐射固化材料。
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