Radiation detector assembly
    2.
    发明授权

    公开(公告)号:US10283557B2

    公开(公告)日:2019-05-07

    申请号:US14985785

    申请日:2015-12-31

    Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

    Radiation detector assembly
    3.
    发明授权

    公开(公告)号:US10686003B2

    公开(公告)日:2020-06-16

    申请号:US14985739

    申请日:2015-12-31

    Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

    X-RAY DETECTOR PANEL
    4.
    发明申请
    X-RAY DETECTOR PANEL 有权
    X射线探测器面板

    公开(公告)号:US20150276941A1

    公开(公告)日:2015-10-01

    申请号:US14242504

    申请日:2014-04-01

    CPC classification number: G01T1/24 G01T1/2018 H01L31/18

    Abstract: An X-ray detector panel includes a plurality of photodetector wafers are arranged in a photodetector array. Each photodetector wafer comprises a sensing surface, a contact surface disposed opposite the sensing surface, and an electrical contact coupled to the contact surface. A substrate is coupled to the photodetector array such that the photodetector array is substantially surrounded by the substrate and a face surface of the substrate is substantially coplanar with the sensing surface. A scintillator is coupled to the face surface of the substrate and substantially covers the sensing surfaces of the photodetector array. A scintillator cover is substantially sealingly coupled to the face surface.

    Abstract translation: X射线检测器面板包括多个光电检测器晶片,其布置在光电检测器阵列中。 每个光电检测器晶片包括感测表面,与感测表面相对设置的接触表面以及耦合到接触表面的电接触。 衬底耦合到光电检测器阵列,使得光电检测器阵列基本上被衬底包围,并且衬底的面表面与感测表面基本上共面。 闪烁体耦合到衬底的表面并且基本上覆盖光电检测器阵列的感测表面。 闪烁体盖基本上密封地联接到表面。

    Active pixel radiation detector array and use thereof

    公开(公告)号:US10032813B2

    公开(公告)日:2018-07-24

    申请号:US15365599

    申请日:2016-11-30

    Abstract: Fabrication and use of an X-ray detector scan interface having separate enable and reset lines for each line (e.g., row) of pixels is described. In certain implementations, the respective enable and reset lines are connected such that activation of an enable line for a given line of pixels is concurrent with activation of a reset line for a different (e.g., preceding) row of pixels. In this manner, readout of one row of pixels is performed in conjunction with resetting the row of pixels readout in the preceding operation. In another technical implementation, a non-rectangular detector is divided into quadrants, with alternating quadrants configured for scan module or data module operations such that no quadrant has overlapping scan and data interconnections at the connection finger regions.

    RADIATION DETECTOR ASSEMBLY
    10.
    发明申请

    公开(公告)号:US20170194374A1

    公开(公告)日:2017-07-06

    申请号:US14985739

    申请日:2015-12-31

    Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.

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