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公开(公告)号:US20190235097A1
公开(公告)日:2019-08-01
申请号:US15881221
申请日:2018-01-26
Applicant: General Electric Company
Inventor: James Liu , Nicholas Konkle , Biju Jacob , Douglas Albagli , William Hennessy , Habib Vafi
Abstract: An imager panel for an x-ray detector for obtaining x-ray images of an object is provided that includes a first portion disposed at the center of the hybrid imager panel that can produce images of a first resolution and a second portion disposed at least partially around the first portion that is capable of producing images of a second resolution. The hybrid imager panel provides a hybrid detector that can be selectively operated to obtain images of varying resolutions corresponding to the first resolution from the first portion, the second resolution from the second portion or a combination thereof.
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公开(公告)号:US10283557B2
公开(公告)日:2019-05-07
申请号:US14985785
申请日:2015-12-31
Applicant: General Electric Company
Inventor: Biju Jacob , Habib Vafi , Brian David Yanoff , Jeffery Jon Shaw , Jianjun Guo
IPC: H01L27/00 , H01L27/146 , G01T1/20 , G01T1/24
Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.
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公开(公告)号:US10686003B2
公开(公告)日:2020-06-16
申请号:US14985739
申请日:2015-12-31
Applicant: General Electric Company
Inventor: Biju Jacob , Habib Vafi , Brian David Yanoff , Jeffery Jon Shaw , Jianjun Guo
IPC: G01T1/24 , H01L27/146 , H04N5/378
Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.
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公开(公告)号:US20150276941A1
公开(公告)日:2015-10-01
申请号:US14242504
申请日:2014-04-01
Applicant: General Electric Company
Inventor: James Zhengshe Liu , Habib Vafi , Paul Richard Granfors
CPC classification number: G01T1/24 , G01T1/2018 , H01L31/18
Abstract: An X-ray detector panel includes a plurality of photodetector wafers are arranged in a photodetector array. Each photodetector wafer comprises a sensing surface, a contact surface disposed opposite the sensing surface, and an electrical contact coupled to the contact surface. A substrate is coupled to the photodetector array such that the photodetector array is substantially surrounded by the substrate and a face surface of the substrate is substantially coplanar with the sensing surface. A scintillator is coupled to the face surface of the substrate and substantially covers the sensing surfaces of the photodetector array. A scintillator cover is substantially sealingly coupled to the face surface.
Abstract translation: X射线检测器面板包括多个光电检测器晶片,其布置在光电检测器阵列中。 每个光电检测器晶片包括感测表面,与感测表面相对设置的接触表面以及耦合到接触表面的电接触。 衬底耦合到光电检测器阵列,使得光电检测器阵列基本上被衬底包围,并且衬底的面表面与感测表面基本上共面。 闪烁体耦合到衬底的表面并且基本上覆盖光电检测器阵列的感测表面。 闪烁体盖基本上密封地联接到表面。
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公开(公告)号:US10823858B2
公开(公告)日:2020-11-03
申请号:US15881221
申请日:2018-01-26
Applicant: General Electric Company
Inventor: James Liu , Nicholas Konkle , Biju Jacob , Douglas Albagli , William Hennessy , Habib Vafi
Abstract: An imager panel for an x-ray detector for obtaining x-ray images of an object is provided that includes a first portion disposed at the center of the hybrid imager panel that can produce images of a first resolution and a second portion disposed at least partially around the first portion that is capable of producing images of a second resolution. The hybrid imager panel provides a hybrid detector that can be selectively operated to obtain images of varying resolutions corresponding to the first resolution from the first portion, the second resolution from the second portion or a combination thereof.
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公开(公告)号:US20190353805A1
公开(公告)日:2019-11-21
申请号:US15984953
申请日:2018-05-21
Applicant: General Electric Company
Inventor: Nicholas Ryan Konkle , Daniel Robert Lochner , Douglas Albagli , Joseph John Kulak , William Andrew Hennessy , Habib Vafi
IPC: G01T1/24 , H01L27/146 , A61B6/00
Abstract: A digital X-ray detector is provided. The digital X-ray detector includes a polymeric substrate. The digital X-ray detector also include a detector array configured to generate image data based on incident X-ray radiation disposed on the polymeric substrate, wherein the polymeric substrate extends beyond an edge of the detector array. The digital X-ray detector further includes scan electronics and readout electronics configured to acquire image data from the detector array, wherein the scan electronics, the readout electronics, or both the scan electronics and the readout electronics are directly disposed on the polymeric substrate.
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公开(公告)号:US10036814B2
公开(公告)日:2018-07-31
申请号:US14807516
申请日:2015-07-23
Applicant: General Electric Company
Inventor: James Zhengshe Liu , Habib Vafi , Paul Richard Granfors
IPC: G01T1/20 , G01T1/24 , H01L27/146
CPC classification number: G01T1/2018 , G01T1/24 , H01L27/14663 , H01L27/1469
Abstract: An x-ray image detector includes a light image sensor having a depth, a front side comprising a sensing surface, and a back side. The x-ray image detector further includes a substrate plate on the back side and surrounding the depth of the light image sensor such that the substrate plate forms a lip around the light image sensor. The lip is level with the front side of the light image sensor. The x-ray image detector further includes a scintillator over the sensing surface of the light image sensor and at least a portion of the lip.
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公开(公告)号:US10032813B2
公开(公告)日:2018-07-24
申请号:US15365599
申请日:2016-11-30
Applicant: General Electric Company
Inventor: James Zhengshe Liu , Habib Vafi , Jingyi Liang , Nicholas Ryan Konkle
IPC: H01L27/146 , G01T1/20
Abstract: Fabrication and use of an X-ray detector scan interface having separate enable and reset lines for each line (e.g., row) of pixels is described. In certain implementations, the respective enable and reset lines are connected such that activation of an enable line for a given line of pixels is concurrent with activation of a reset line for a different (e.g., preceding) row of pixels. In this manner, readout of one row of pixels is performed in conjunction with resetting the row of pixels readout in the preceding operation. In another technical implementation, a non-rectangular detector is divided into quadrants, with alternating quadrants configured for scan module or data module operations such that no quadrant has overlapping scan and data interconnections at the connection finger regions.
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公开(公告)号:US20170194375A1
公开(公告)日:2017-07-06
申请号:US14985785
申请日:2015-12-31
Applicant: General Electric Company
Inventor: Biju Jacob , Habib Vafi , Brian David Yanoff , Jeffery Jon Shaw , Jianjun Guo
IPC: H01L27/146 , G01T1/24 , G01T1/20
CPC classification number: H01L27/14689 , G01T1/2018 , G01T1/247 , H01L27/14625 , H01L27/14636 , H01L27/14658 , H01L27/14661 , H01L27/14663 , H01L27/1469
Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.
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公开(公告)号:US20170194374A1
公开(公告)日:2017-07-06
申请号:US14985739
申请日:2015-12-31
Applicant: General Electric Company
Inventor: Biju Jacob , Habib Vafi , Brian David Yanoff , Jeffery Jon Shaw , Jianjun Guo
IPC: H01L27/146 , G01T1/24 , H04N5/378
Abstract: Various approaches are discussed for using four-side buttable CMOS tiles to fabricate detector panels, including large-area detector panels. Fabrication may utilize pads and interconnect structures formed on the top or bottom of the CMOS tiles. Electrical connection and readout may utilize readout and digitization circuitry provided on the CMOS tiles themselves such that readout of groups or sub-arrays of pixels occurs at the tile level, while tiles are then readout at the detector level such that readout operations are tiered or multi-level.
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